IP Library Granted Patent US 8,736,950
Granted Patent B2
US 8,736,950 · App. 13/652,159 · Granted May 27, 2014

MEMS deployment flexures

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Quick Facts
Patent No.
US 8,736,950
App. No.
13/652,159
Granted
May 27, 2014
Kind
B2
Abstract

A flexure assembly can have a stage that is deployed to a desired position by attachment of the flexure assembly to a housing. For example, a frame can be configured to be held in position by one portion of the housing and a deployment pad can be configured to be held in position by another portion of the housing. A deployment flexure can be configured to facilitate positioning of the frame and the deployment pad out-of-plane with respect to one another. The deployment flexure and a motion control flexure can facilitate movement of the stage with respect to the housing. In this manner, the position of the stage and the preload of the stage are determined by the housing.

Claims (14)

1. A method comprising:

providing a flexure assembly having a frame, a stage, a deployment pad, a motion control flexure that interconnects the frame and the stage, and a deployment flexure that interconnects the stage and the deployment pad;

providing a housing;

engaging the housing with the deployment pad; and

wherein the engaging the housing moves the stage from an undeployed position to a deployed position.

2. The method of claim 1 , wherein the deployment flexure is a micro electromechanical systems (MEMS) flexure.

3. The method of claim 1 , wherein the deployment flexure is generally planar in configuration prior to engaging the housing with the deployment pad.

4. The method of claim 1 , wherein the deployment flexure is deformed by structures of the housing in a manner that moves the stage out-of-plane.

5. The method of claim 1 , wherein the deployment flexure is comparatively soft in one degree of freedom and is formed from silicon.

6. The method of claim 1 , wherein the deployment flexure and the motion control flexure are comparatively soft in a plurality of degrees of freedom and are formed from silicon.

7. The method of claim 1 , wherein the deployment flexure moves the stage from an undeployed position to a deployed position.

8. The method of claim 1 , further comprising attaching an optical element to the stage.

9. The method of claim 8 , further comprising incorporating the flexure assembly with the housing into a camera, wherein the optical element is disposed along an optical axis of the camera.

10. The method of claim 9 , further comprising incorporating the camera into a personal electronic device, and wherein the optical element comprises a lens.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 15, 2012
From: CALVET, ROBERT J.; GUTIERREZ, ROMAN C.; LIU, XIAOLEI; JAIN, ANKUR
To: DIGITALOPTICS CORPORATION MEMS
Reel/Frame 029131/0751 →