Granted Patent B1

US 8,685,769 · App. 13/652,220 · Granted Apr 1, 2014

Abstract

Claims (8)

1. A method of forming a charge pattern on a microchip residing on a wafer, comprising: depositing a material on the surface of the microchip; and using an external device to develop charge in the material; and singulating the wafer into microchips after charging.

2. The method of claim 1 , wherein using an external device to develop the charge comprises charging the material with one of either a corotron or a scorotron.

3. The method of claim 1 , wherein depositing the material comprises depositing a photoconductor.

4. The method of claim 1 , wherein depositing the material comprises laminating a dry film photoresist onto a wafer and exposing the dry film photoresist to ultraviolet light, and developing the charge comprises charging the exposed photoresist with a scorotron.

5. The method of claim 4 , wherein exposing the dry film comprises applying a stencil mask to the dry film resist to expose a portion of a low conductivity region and applying a first charge with a scorotron.

6. The method of claim 4 , further comprising re-exposing the dry film resist with a second charge with a scorotron.

7. The method of claim 1 , wherein the depositing of the material comprises depositing one of a polymer, an inorganic material or a mixture of an inorganic and a polymer.

8. The method of claim 7 , wherein developing the charge comprises tribo-charging.

Assignments (10)