Multiple temperature measurements coupled with modeling
The present invention is directed to, inter alia, systems and methods for calculating a temperature associated with an analyte measurement component of a biosensing instrument (such as a blood glucose monitor), with a test strip that is inserted in a biosensing instrument, or both. The present systems and methods may employ at least two temperature sensors, and the acquired temperature information may be used to modulate data regarding an analyte in a biological sample, thereby providing a more accurate measurement of the analyte.
1. A method for calculating temperature associated with a test strip inserted in an analyte assessing system comprising:
measuring a first temperature at a first position that is in thermal communication with a heat source in said analyte assessing system;
measuring a second temperature at a second position in said analyte assessing system that is in thermal communication with said heat source to a lesser extent relative to said first position; and,
using the measured first temperature and the measured second temperature to calculate the temperature associated with said test strip,
wherein
said first temperature is measured by a first temperature sensor and said second temperature is measured by a second temperature sensor;
said system comprises a housing that encloses said first temperature sensor and said second temperature sensor, a first opening in said housing at a location proximal to said second temperature sensor, a second opening at a second location in said housing, and a channel extending between said first opening and said second opening and containing said second temperature sensor, wherein each of said openings place said channel in fluid communication with the ambient environment outside of said housing, and,
ambient air contacts said second temperature sensor and displaces heated air proximate said second temperature sensor.
2. The method according to claim 1 wherein insulating material is interposed between said second temperature sensor and said heat source.
3. The method according to claim 1 wherein insulating material is interposed between said second temperature sensor and said first temperature sensor.
4. The method according to claim 1 further comprising compensating for said calculated temperature associated with said test strip during a measurement of an analyte on said test strip.
5. The method according to claim 1 wherein said temperature associated with said test strip is calculated by a processor housed within said system.
6. The method according to claim 5 wherein said processor is in electronic communication with a first temperature sensor that measures said first temperature, and with a second temperature sensor that measures said second temperature.
7. The method according to claim 5 wherein said processor calculates said temperature (TA) associated with said test strip by performing a calculation according to formula (I)
TA
=
TS
+
K
K
-
1
(
TM
-
TS
)
(
I
)
wherein TS is the temperature measured by said second temperature sensor, TM is the temperature measured by the first temperature sensor, and K is defined by
K
=
(
TS
-
TA
)
(
TM
-
TA
)
wherein TS is the temperature measured by the second temperature sensor, TA is the actual temperature of the ambient environment outside of said housing, and TM is the temperature measured by the first temperature sensor.
8. The method according to claim 1 wherein said housing substantially defines an internal space, and wherein said second temperature sensor is positioned proximate an opening in said housing.
9. The method according to claim 8 wherein said system is configured to reduce the heat transfer resistance between the second temperature sensor and the ambient environment outside of said housing.
10. The method according to claim 8 wherein said system further comprises insulating material that at least partially isolates said second temperature sensor, said heat conductive material, and said opening from the remainder of the internal space of said housing.
11. The method according to claim 8 wherein heat conductive material is disposed between said second temperature sensor and said opening in said housing.
12. The method according to claim 11 wherein said second temperature sensor is mounted on said heat conductive material.
13. The method according to claim 11 wherein said heat conductive material comprises metal or plastic.
14. A method for calculating temperature associated with a test strip inserted in an analyte assessing system comprising:
measuring a first temperature at a first position that is in thermal communication with a heat source in said analyte assessing system;
measuring a second temperature at a second position in said analyte assessing system that is in thermal communication with said heat source to a lesser extent relative to said first position; and,
using the measured first temperature and the measured second temperature to calculate the temperature associated with said test strip,
wherein
said temperature associated with said test strip is calculated by a processor housed within said system, and,
said processor calculates said temperature (TA) associated with said test strip by performing a calculation according to formula (I)
TA
=
TS
+
K
K
-
1
(
TM
-
TS
)
(
I
)
wherein TS is the second temperature, TM is the first temperature, and K is defined by
K
=
(
TS
-
TA
)
(
TM
-
TA
)
wherein TS is the second temperature, TA is the actual temperature of the ambient environment outside of said housing, and TM is the first temperature.
15. The method according to claim 14 wherein said processor is in electronic communication with a first temperature sensor that measures said first temperature, and with a second temperature sensor that measures said second temperature.
16. The method according to claim 14 wherein said first temperature is measured by a first temperature sensor and said second temperature is measured by a second temperature sensor, and wherein said first temperature sensor and said second temperature sensor are each housed within said system.
17. The method according to claim 16 wherein insulating material is interposed between said first temperature sensor and said heat source.
18. The method according to claim 16 wherein insulating material is interposed between said second temperature sensor and said heat source.
19. The method according to claim 16 wherein insulating material is interposed between said second temperature sensor and said first temperature sensor.
20. The method according to claim 16 wherein said system comprises a housing that encloses said first temperature sensor and said second temperature sensor and substantially defines an internal space, and wherein said second temperature sensor is positioned proximate an opening in said housing.
21. The method according to claim 20 wherein said system is configured to reduce the heat transfer resistance between the second temperature sensor and the ambient environment outside of said housing.
22. The method according to claim 20 wherein said system further comprises insulating material that at least partially isolates said second temperature sensor, said heat conductive material, and said opening from the remainder of the internal space of said housing.
23. The method according to claim 20 wherein heat conductive material is disposed between said second temperature sensor and said opening in said housing.
24. The method according to claim 23 wherein said second temperature sensor is mounted on said heat conductive material.
25. The method according to claim 23 wherein said heat conductive material comprises metal or plastic.