SEMICONDUCTOR DEVICE MEMBER, PRODUCTION METHOD OF SEMICONDUCTOR-DEVICE-MEMBER FORMATION LIQUID AND SEMICONDUCTOR DEVICE MEMBER, AND SEMICONDUCTOR-DEVICE-MEMBER FORMATION LIQUID, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING SYSTEM AND IMAGE DISPLAY SYSTEM USING THE SAME
To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30% or lower, in the semiconductor device member.
1 . A method for producing a curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the method comprising polycondensating a polysiloxane oligomerconsisting only of bifunctional silicon and having a molecular weight of 400 or larger with a silane monomer comprising tri- or more functional silicon or with a polysiloxane oligomer containing tri- or more functional silicon,
the curable organopolysiloxane composition containing a component having a molecular weight of 800 or smaller at a proportion of, in areal ratio of GPC, 10% or less.
2 . The method according to claim 1 , wherein the material to be polycondensated in the polycondensating includes the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger at 50 wt % or more to the total weight of the material.
3 . The method according to claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a polysiloxane consisting only of bifunctional silicon and having silanols at the both terminals.
4 . The method according to claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a polydimethylsiloxane having silanols at the both terminals.
5 . The method according to claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a diphenylsiloxane-dimethylsiloxane copolymer having silanols at the both terminals.
6 . The method according to claim 1 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes a polydiphenylsiloxane having silanols at the both terminals.
7 . The method according to claim 1 , wherein the polycondensating uses an organometallic compound catalyst.
8 . The method according to claim 1 , further comprising,
after the polycondensating, distilling the solvent.
9 . The method according to claim 1 , further comprising,
after the polycondensating, mixing inorganic particle.
10 . The method according to claim 1 , further comprising,
after the polycondensating, adding phosphor particle.
11 . A method for producing a curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the method comprising:
polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends with a silane monomer comprising tri- or more functional silicon and having an alkoxy group or with a polysiloxane oligomer containing tri- or more functional silicon and having an alkoxy group; and
removing alcohol generated in the polycondensation, wherein
a ratio represented by {(the number of alkoxy groups)/(the number of silanols+the number of alkoxy groups)}×100(%) after the distilling is 0% or more and 50% or less.
12 . The method according to claim 11 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydimethylsiloxane.
13 . The method according to claim 11 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes a diphenylsiloxane-dimethylsiloxane copolymer.
14 . The method according to claim 11 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydiphenylsiloxane.
15 . The method according to claim 11 , wherein the polycondensating uses an organometallic compound catalyst.
16 . The method according to claim 11 , further comprising,
after the polycondensating, mixing inorganic particle.
17 . The method according to claim 11 , further comprising,
after the polycondensating, adding phosphor particle.
18 . A curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the compound comprising a polycondensate obtained by polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger with a silane monomer comprising tri- or more functional silicon or with a polysiloxane oligomer containing tri- or more functional silicon,
the curable organopolysiloxane composition containing a component having a molecular weight of 800 or smaller at a proportion of, in areal ratio of GPC, 10% or less.
19 . The curable organopolysiloxane composition according to claim 18 , having a viscosity at 25° C. of 20 mPa·s or more and 1500 mPa·s or less.
20 . The curable organopolysiloxane composition according to claim 18 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes polydimethylsiloxane.
21 . The curable organopolysiloxane composition according to claim 18 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes diphenylsiloxane-dimethylsiloxane copolymer.
22 . The curable organopolysiloxane composition according to claim 18 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having a molecular weight of 400 or larger includes polydiphenylsiloxane.
23 . The curable organopolysiloxane composition according to claim 18 , further comprising inorganic particle.
24 . The curable organopolysiloxane composition according to claim 18 , further comprising phosphor particle.
25 . A curable organopolysiloxane composition for a semiconductor device, the curable organopolysiloxane composition forming a siloxane bond when being cured, the curable organopolysiloxane composition comprising a polycondensate obtained by polycondensating a polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends with a silane monomer comprising tri- or more functional silicon and having an alkoxy group or with a polysiloxane oligomer containing tri- or more functional silicon and having an alkoxy group, wherein the curable organopolysiloxane composition has a ratio represented by {(the number of alkoxy groups)/(the number of silanols+the number of alkoxy groups)}×100(%) of 0% or more and 50% or less.
26 . The curable organopolysiloxane composition according to claim 25 , having a viscosity at 25° C. of 20 mPa·s or more and 1500 mPa·s or less.
27 . The curable organopolysiloxane composition according to claim 25 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydimethylsiloxane.
28 . The curable organopolysiloxane composition according to claim 25 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes diphenylsiloxane-dimethylsiloxane copolymer.
29 . The curable organopolysiloxane composition according to claim 25 , wherein the polysiloxane oligomer consisting only of bifunctional silicon and having silanols at the both ends includes polydiphenylsiloxane.
30 . The curable organopolysiloxane composition according to claim 25 , further comprising inorganic particle.
31 . The curable organopolysiloxane composition according to claim 25 , further comprising phosphor particle.
32 . A method for producing a semiconductor device, the method comprising curing the curable organopolysiloxane composition defined in one of claim 18 .