IP Library Granted Patent US 9,936,588
Granted Patent B2
US 9,936,588 · App. 13/655,135 · Granted Apr 3, 2018

Printed circuit board having a non-plated hole with limited drill depth

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Quick Facts
Patent No.
US 9,936,588
App. No.
13/655,135
Granted
Apr 3, 2018
Kind
B2
Abstract

A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Claims (13)

1. A printed circuit board, comprising:

a planar substrate having a first face, a second face opposite the first face, and a plurality of conductive layers disposed between nonconductive layers of the planar substrate;

a plurality of holes extending into the planar substrate from the first face to a predetermined depth intermediate the first and second faces, wherein the hole extends through a first subset of the conductive layers but does not extend through a second subset of the conductive layers;

a plurality of mechanical locating pins, each pin received into one of the plurality of holes, wherein the mechanical locating pin is disposed to mechanically align a first component for electronically interfacing with the planar substrate; and

a second component on the second face directly opposite of the hole, wherein the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

2. The printed circuit board of claim 1 , wherein the printed circuit board is a backplane.

3. The printed circuit board of claim 1 , wherein the first component is a disk drive.

4. The printed circuit board of claim 1 , wherein the second component is an integrated circuit in electronic communication with the conductive traces or interconnects through a ball grid array.

5. The printed circuit board of claim 1 , wherein the second component is an integrated circuit in electronic communication with the conductive traces or interconnects through a pin grid array.

6. The printed circuit board of claim 1 , wherein the hole extends through less than or equal to half of the conductive layers in the substrate.

7. The printed circuit board of claim 1 , further comprising:

the first component mechanically engaged with one or more of the mechanical locating pins and electronically interfaced with the planar substrate.

8. The printed circuit board of claim 7 , wherein the first component is a disk drive.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2019
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 050310/0988 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 10, 2014
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 034194/0111 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2012
From: ANDRESEN, MARK E.; OTT, VIRGINIA
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 029155/0927 →