Plasma processing apparatus
View Patent ↗A plasma processing apparatus has a long chamber having an opening portion, a gas supply apparatus that supplies gas into the chamber, a spiral coil having a long shape in parallel with the longitudinal direction of the chamber, a high-frequency electric power supply connected to the spiral coil, a base material mounting table which is disposed opposite to the opening portion and holds a base material and a moving mechanism which is disposed in parallel with the longitudinal direction of the chamber and the longitudinal direction of the opening portion, and enables the chamber and the base material mounting table to relatively move perpendicularly with respect to the longitudinal direction of the opening portion.
1. A plasma processing apparatus comprising:
a chamber having an opening portion;
a gas supply apparatus that supplies gas into the chamber;
two spiral coils;
a high-frequency electric power supply connected to the spiral coils;
a base material mounting table which is disposed opposite to the opening portion and holds a base material; and
a moving mechanism which enables the chamber and the base material mounting table to relatively move,
wherein the chamber is sandwiched between the two spiral coils.
2. The plasma processing apparatus according to claim 1 ,
wherein at least one of the spiral coils is planer.
3. The plasma processing apparatus according to claim 2 ,
wherein an inner wall surface of the chamber on a side near the at least one of the two spiral coils is a plane in parallel with a plane that the at least one of the two spiral coils forms.
4. The plasma processing apparatus according to claim 1 ,
wherein the chamber is configured as a space sandwiched by two dielectric plates having a groove on at least one side.
5. The plasma processing apparatus according to claim 1 ,
wherein a depth of the chamber is 1 mm to 5 mm.
6. The plasma processing apparatus according to claim 1 ,
wherein the at least one of the two spiral coils is constituted by a hollow tube, is configured to allow a cooling medium to flow therein, and is adhered to a member that composes a wall surface of the chamber or a member adhered to the member that composes the wall surface of the chamber.