IP Library Granted Patent US 8,897,082
Granted Patent B2
US 8,897,082 · App. 13/661,711 · Granted Nov 25, 2014

Data transmission circuit and semiconductor memory device including the same

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Quick Facts
Patent No.
US 8,897,082
App. No.
13/661,711
Granted
Nov 25, 2014
Kind
B2
Abstract

The data transmission circuit includes: a plurality of local bit line pairs through which data is read simultaneously; a plurality of voltage change detection circuits provided for the plurality of local bit line pairs; a global bit line pair; a plurality of column selection circuits configured to select one of the local bit line pairs and connect the selected local bit line pair to the global bit line pair; and a sense amplifier connected to the global bit line pair. The sense amplifier is controlled by a sense amplifier activation signal to which the outputs of the plurality of voltage change detection circuits are connected, whereby the voltage of a selected read data line pair is amplified using discharge of a non-selected read data line pair, to achieve high-speed read.

Claims (39)

1. A data transmission circuit, comprising:

a plurality of first bit lines through which data is read simultaneously;

a plurality of voltage change detection circuits provided for the plurality of first bit lines;

a second bit line;

a plurality of selection circuits configured to select one of the plurality of first bit lines according to a first control signal and connect the selected first bit line to the second bit line; and

a sense amplifier connected to the second bit line, wherein

the sense amplifier is controlled by a first sense amplifier activation signal to which outputs of the plurality of voltage change detection circuits are connected.

2. The data transmission circuit of claim 1 , further comprising:

a plurality of local sense amplifiers provided for the plurality of first bit lines and controlled by the first sense amplifier activation signal.

3. The data transmission circuit of claim 2 , wherein

the sense amplifier connected to the second bit line is controlled by a second sense amplifier activation signal activated by the first sense amplifier activation signal.

4. The data transmission circuit of claim 1 , wherein

the plurality of selection circuits are controlled by the first sense amplifier activation signal.

5. The data transmission circuit of claim 1 , further comprising:

a plurality of precharge circuits provided for the plurality of first bit lines; and

a plurality of read circuits provided for the plurality of first bit lines, wherein

at least the plurality of read circuits are controlled by the first sense amplifier activation signal.

6. The data transmission circuit of claim 1 , further comprising:

a forced activation circuit configured to activate the first sense amplifier activation signal according to a forced activation signal.

7. The data transmission circuit of claim 6 , wherein

the forced activation signal is a write enable signal.

8. The data transmission circuit of claim 1 , further comprising:

a forced deactivation circuit configured to deactivate the first sense amplifier activation signal according to a forced deactivation signal.

9. The data transmission circuit of claim 1 , wherein

at least one first bit line out of the plurality of first bit lines connected to a same selection circuit does not output data simultaneously according to a second control signal.

10. A semiconductor memory device comprising the data transmission circuit of claim 1 , wherein

a plurality of memory cells are connected to each of the plurality of first bit lines.

11. The semiconductor memory device of claim 10 , wherein

read from the pluralities of memory cells is started by a common control signal, and the pluralities of memory cells are adjacent in a direction parallel to the direction of the common control signal.

12. The semiconductor memory device of claim 10 , wherein

the plurality of first bit lines connected to a same selection circuit are continuous in a direction parallel to the plurality of first bit lines.

13. The semiconductor memory device of claim 10 , wherein

a power supply control circuit is provided for each memory block including the plurality of first bit lines connected to the same sense amplifier via the plurality of selection circuits, and the power supply control circuit is connected to power supply of the plurality of memory cells included in the memory block.

14. The semiconductor memory device of claim 10 , wherein

a power supply control circuit is provided for each bit block having a plurality of memory cells connected to a same output terminal, and the power supply control circuit is connected to power supply of the plurality of memory cells included in the bit block.

15. The semiconductor memory device of claim 10 , wherein

the shape of the plurality of memory cells in each bit block having the plurality of memory cells connected to a same output terminal is different every bit block.

16. The semiconductor memory device of claim 10 , wherein

the shape of the plurality of memory cells in each memory block including the plurality of first bit lines connected to the same sense amplifier via the plurality of selection circuits is different every memory block.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 25, 2015
From: PANASONIC CORPORATION
To: SOCIONEXT INC.
Reel/Frame 035294/0942 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2014
From: KOIKE, TSUYOSHI
To: PANASONIC CORPORATION
Reel/Frame 031968/0647 →