Wafer-scaled light-emitting structure

1. A method of manufacturing a light-emitting structure, comprising:

providing a supportive substrate;

forming an anti-deforming layer on the supportive substrate;

providing a growth substrate;

forming a light-emitting stacked layer on the growth substrate, wherein the light-emitting stacked layer comprises at least an active layer;

connecting the light-emitting stacked layer and the anti-deforming layer by a bonding layer;

thinning the supportive substrate; and

removing the growth substrate;

wherein the anti-deforming layer reduces the deformation of the light-emitting structure located on the supportive substrate, and

wherein said connecting the light-emitting stacked layer and the anti-deforming layer by said bonding layer, said thinning the supportive substrate and said removing the growth substrate are performed sequentially.

2. The method of manufacturing the light-emitting structure as described in claim 1 , wherein the method of forming the anti-deforming layer on the supportive substrate is selected from a group consisting of CVD, MOCVD, VPE, LPE, MBE, and PECVD.

3. The method of manufacturing the light-emitting structure as described in claim 1 , wherein the method of thinning the supportive substrate comprises CMP or etching.

4. The method of manufacturing the light-emitting structure as described in claim 1 , further comprising forming a reflective layer between the light-emitting stacked layer and the bonding layer or between the anti-deforming layer and the bonding layer.

5. The method of manufacturing the light-emitting structure as described in claim 4 , wherein a material of the reflective layer is selected from a group consisting of In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Ge, Cu, Ni, AuBe, AuGe, AuZn, PbSn, the combination thereof, and DBR.

6. The method of manufacturing the light-emitting structure as described in claim 1 , further comprising forming a protective layer on the light-emitting stacked layer.

7. The method of manufacturing the light-emitting structure as described in claim 6 , wherein a material of the protective layer is selected from a group consisting of dielectric material, Su8, BCB, PFCB, Epoxy, Acrylic Resin, COC, PMMA, PET, PC, Polyetherimide, Fluorocarbon Polymer, Silicone, Glass, Al x O y , SiOx, SiN X , TiO x , SOG, the combination thereof, and other transparent materials.

8. The method of manufacturing the light-emitting structure as described in claim 1 , further comprising dicing the light-emitting structure to form a plurality of chip light-emitting structures.

9. The method of manufacturing the light-emitting structure as described in claim 1 , wherein the supportive substrate is thinned to a thickness less than 70 μm.

10. The method of manufacturing the light-emitting structure as described in claim 1 , wherein the supportive substrate is thinned to a thickness less than 40 μm.

11. The light-emitting structure as described in claim 1 , wherein a material of the supportive substrate is selected from a group consisting of metal, electrical insulating material, composite material, metal matrix composite (MMC), ceramic matrix composite (CMC), Si, IP, ZnSe, AlN, GaAs, SiC, GaP, GaAsP, Sapphire, ZnSe, ZnO, InP, LiGaO 2 , LiAlO 2 , and the combination thereof.

12. The method of manufacturing the light-emitting structure as described in claim 1 , wherein a material of the anti-deforming layer is selected from a group consisting of Al x O y , SiN x , SiO x , TiO x , GaN, and the combination thereof.

13. The method of manufacturing the light-emitting structure as described in claim 1 , wherein the anti-deforming layer comprises a deposition defect of molecules or a microcosmic structure.

14. The method of manufacturing the light-emitting structure as described in claim 1 , wherein a thickness of the anti-deforming layer is either smaller than about 10 μm or larger than about 2 μm.

15. The method of manufacturing the light-emitting structure as described in claim 1 , wherein a material of the bonding layer is selected from a group consisting of PI, BCB, PFCB, Epoxy, other organic adhesive materials, In, Sn, Al, Au, Pt, Zn, Ag, Ti, Pb, Pd, Ge, Cu, Ni, AuSn, InAg, InAu, AuBe, AuGe, AuZn, PbSn, PdIn, and the combination thereof.

16. The method of manufacturing as described in claim 1 , wherein the anti-deforming layer provides a reverse stress against stress generated in the light-emitting structure.