Macro channel water-cooled heat-sink for diode-laser bars
View Patent ↗A diode-laser bar is mounted on water-cooled heat-sink between two ceramic sub-mounts for electrically isolating cooling-water in the heat-sink from the diode-laser bar. Mounting between the two ceramic sub-mounts also provides for balancing stresses due to differences in coefficient of thermal expansion (CTE) between the sub-mounts and the diode-laser bar. Both sub-mounts are in thermal communication with the heat-sink for providing two-sided cooling of the diode-laser bar.
1. Diode-laser apparatus, comprising:
a heat-sink, the heat-sink comprising:
a base,
first and second cooling-members spaced apart, facing each other, and in thermal communication with the base, and
first and second thermally conductive, electrically insulating, sub-mounts of a ceramic material, each thereof having first and second opposite surfaces; and
a diode-laser bar assembly located between the first and second cooling-members, the diode-laser bar assembly including a diode-laser bar solder-bonded between the first surfaces of the first and second sub-mounts, with the second surfaces of the first and second sub-mounts in thermal communication with respectively the first and second cooling-members.
2. The apparatus of claim 1 , wherein the first and second sub-mounts each have a length greater than the length of the diode-laser bar and are arranged partially overlapping, with the diode-laser between overlapped portions of the sub-mounts, and with a non-overlapped of the first sub-mount extending beyond one end of the diode-laser bar and a non-overlapped portion of the second sub-mount extending beyond an opposite end of the diode laser bar.
3. The apparatus of claim 2 , wherein electrical connection to the diode-laser bar is made via the first surfaces of the non-overlapped portions of the first and second sub-mounts, whereby the diode laser bar is electrically isolated from the heat sink.
4. The apparatus of claim 1 , wherein a gold/tin solder is used for the solder-bonding of the sub-mounts to the diode-laser bar.
5. The apparatus of claim 1 , wherein the first and second cooling-members are copper cooling-members and the ceramic material of the sub-mounts is one of beryllium oxide and aluminum nitride.
6. The apparatus of claim 1 , wherein the first-cooling-member is a physically integral, platform-portion of the heat-sink, water-cooled by flowing water through coolant-channels formed below the platform-portion of the heat-sink, and the diode-laser has an emission-direction about parallel to the platform-portion of the heat-sink.
7. The apparatus of claim 6 wherein the second cooling-member is a physically separate member, solder-bonded to the second surface of the second sub-mount.
8. The apparatus of claim 1 , wherein the first and second cooling-members are physically integral portions of the heat-sink extending from the heat-sink and the diode-laser bar has an emission direction in the extension-direction of the cooling-members.
9. The apparatus of claim 8 , wherein each of the first and second cooling-members is water-cooled by flowing water through a channel formed therein.
10. The apparatus of claim 9 , wherein the first sub-mount is solder-bonded to the first cooling-member, and wherein there is a thermally conductive packing-material between the second sub-mount and the second cooling-member.
11. Diode-laser apparatus, comprising:
a heat-sink, the heat sink comprising:
a base,
a mounting platform on the base, and
first and second thermally conductive, electrically insulating, sub-mounts of a ceramic material, each thereof having first and second opposite surfaces; and
a diode-laser bar assembly mounted on the mounting-platform, the diode-laser bar assembly including a diode-laser bar having an emission direction parallel to the mounting platform and being solder-bonded between the first surfaces of the first and second sub-mounts, with the second surface of the first sub-mount solder-bonded to the mounting platform;
a cooling-block mounted on the second surface of the second sub-mount in thermal communication with the sub-mount and the base.
12. The apparatus of claim 11 , wherein the mounting platform of the base is water-cooled by flowing water through cooling-channels formed in the base below the mounting-platform.
13. The apparatus of claim 12 , wherein the first and second sub-mounts each have a length greater than the length of the diode-laser bar, and are arranged partially overlapping, with the diode-laser between overlapped portions of the sub-mounts, and with a non-overlapped of the first sub-mount extending beyond one end of the diode-laser bar and a non-overlapped portion of the second sub-mount extending beyond an opposite end of the diode laser bar, and wherein electrical connection to the diode-laser bar is made via the first surfaces of the non-overlapped portions of the first and second sub-mounts, whereby the diode laser bar is electrically isolated from the flowing-water in the cooling channels formed in the base.
14. The apparatus of claim 11 , wherein a gold/tin solder is used for the solder-bonding of the sub-mounts to the diode-laser bar.
15. Diode-laser apparatus, comprising:
a heat-sink, the heat sink comprising:
a base,
first and second cooling-members extending from the base, the first and second cooling-members being spaced apart, facing each other, and in thermal communication with the base, and
first and second thermally conductive, electrically insulating, sub-mounts of a ceramic material, each thereof having first and second opposite surfaces; and
a diode-laser bar assembly located between the first and second cooling-members, the diode-laser bar assembly including a diode-laser bar having an emission direction in the direction of extension of the cooling members and being solder-bonded between the first surfaces of the first and second sub-mounts, with the second surfaces of the first and second sub-mounts in thermal communication with respectively the first and second cooling-members.
16. The apparatus of claim 15 , wherein each of the cooling members is water-cooled by flowing water through a cooling-channel formed therein.
17. The apparatus of claim 16 , wherein the first and second sub-mounts each have a length greater than the length of the diode-laser bar, and are arranged partially overlapping, with the diode-laser between overlapped portions of the sub-mounts, and with a non-overlapped of the first sub-mount extending beyond one end of the diode-laser bar and a non-overlapped portion of the second sub-mount extending beyond an opposite end of the diode laser bar, and wherein electrical connection to the diode-laser bar is made via the first surfaces of the non-overlapped portions of the first and second sub-mounts, whereby the diode laser bar is electrically isolated from the flowing water in the cooling channels of the cooling members.
18. The apparatus of claim 17 , wherein a gold/tin solder is used for the solder-bonding of the sub-mounts to the diode-laser bar.