IP Library Granted Patent US 9,401,692
Granted Patent B2
US 9,401,692 · App. 13/663,449 · Granted Jul 26, 2016

Acoustic resonator having collar structure

Inventors: Dariusz Burak (Fort Collins, CO); Alexandre Shirakawa (San Jose, CA); John Choy (Westminster, CO); Phil Nikkel (Loveland, CO)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H03H9/02118H03H9/02157H03H9/132H03H9/173
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Quick Facts
Patent No.
US 9,401,692
App. No.
13/663,449
Granted
Jul 26, 2016
Kind
B2
Abstract

A bulk acoustic wave (BAW) resonator structure comprises a first electrode disposed over a substrate, a first piezoelectric layer disposed over the first electrode, a second electrode disposed over the first piezoelectric layer, and a collar structure disposed around a perimeter of an active region defined by an overlap between the first electrode, the second electrode, and the piezoelectric layer.

Claims (65)

1. A bulk acoustic wave (BAW) resonator structure, comprising:

a substrate comprising a trench;

a first electrode disposed over the substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer;

a collar structure comprising a dielectric material of predetermined width and height disposed around a perimeter of an active region, which is defined by an overlap between the first electrode, the second electrode, the piezoelectric layer, and the trench; and

a first planarization layer formed on the piezoelectric layer adjacent to the second electrode, the first planarization layer comprising a first layer having a first acoustic impedance and a second layer formed on the first layer and having a second acoustic impedance lower than the first acoustic impedance.

2. The BAW resonator structure of claim 1 , wherein the collar structure is formed over a first planarization layer and the second electrode.

3. The BAW resonator structure of claim 1 , wherein the first layer comprises silicon carbide and the second layer comprises non-etchable borosilicate glass.

4. The BAW resonator structure of claim 1 , wherein the collar structure has an inner edge that extends into the active region.

5. The BAW resonator structure of claim 1 , wherein the collar structure further comprises an integrated frame.

6. The BAW resonator structure of claim 1 , wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

7. The BAW resonator structure of claim 1 , wherein the collar structure is formed on the first electrode.

8. The BAW resonator structure of claim 1 , wherein the collar structure is formed between the first electrode and the piezoelectric layer.

9. The BAW resonator structure of claim 8 , wherein the dielectric material comprises carbon doped silicon oxide.

10. The BAW resonator structure of claim 1 , wherein the collar structure is formed between the substrate and the first electrode.

11. The BAW resonator structure of claim 1 , wherein the trench comprises an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

12. The BAW resonator structure of claim 11 , further comprising a second planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the second planarization layer and the first electrode.

13. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a first piezoelectric layer disposed over the first electrode;

a second electrode disposed over the first piezoelectric layer; and

a collar structure comprising a dielectric material of predetermined width and height disposed around a perimeter of an active region which is defined by an overlap between the first electrode, the second electrode and the piezoelectric layer, the collar structure having an inner edge that is substantially aligned with an outer edge of the second electrode, wherein the collar structure is disposed on the first electrode, or between the first electrode and the piezoelectric layer.

14. The BAW resonator structure of claim 13 , further comprising an acoustic mirror formed between the first electrode and the substrate.

15. The BAW resonator structure of claim 13 , wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

16. The BAW resonator structure of claim 13 , wherein the dielectric material comprises carbon doped silicon oxide.

17. The BAW resonator structure of claim 13 , further comprising a planarization layer formed on the piezoelectric layer adjacent to the second electrode.

18. The BAW resonator structure of claim 13 , wherein the substrate has a trench containing an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

19. The BAW resonator structure of claim 18 , wherein the collar structure is disposed on the first electrode and the BAW resonator structure further comprising a planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the planarization layer and the first electrode.

20. The BAW resonator structure of claim 13 , wherein the collar structure further comprises an integrated frame.

21. A bulk acoustic wave (BAW) resonator structure, comprising:

a first electrode disposed over a substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer; and

a collar structure comprising a dielectric material of predetermined width and height disposed around a perimeter of an active region which is defined by an overlap between the first electrode, the second electrode and the piezoelectric layer, the collar structure having a cutoff frequency that is substantially the same as a cutoff frequency of the active region.

22. The BAW resonator structure of claim 21 , wherein the collar structure has an inner edge that extends into the active region.

23. The BAW resonator structure of claim 21 , further comprising an acoustic mirror formed between the first electrode and the substrate.

24. The BAW resonator structure of claim 21 , wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

25. The BAW resonator structure of claim 21 , wherein the collar structure is formed on the first electrode.

26. The BAW resonator structure of claim 21 , wherein the collar structure is formed between the first electrode and the piezoelectric layer.

27. The BAW resonator structure of claim 26 , wherein the dielectric material comprises carbon doped silicon oxide.

28. The BAW resonator structure of claim 21 , wherein the collar structure is formed between the substrate and the first electrode.

29. The BAW resonator structure of claim 21 , wherein the collar structure further comprises an integrated frame.

30. The BAW resonator structure of claim 21 , further comprising a planarization layer formed on the piezoelectric layer adjacent to the second electrode.

31. The BAW resonator structure of claim 21 , wherein the collar structure is formed over a planarization layer formed on the piezoelectric layer and the second electrode.

32. The BAW resonator structure of claim 31 , wherein the planarization layer comprises a first layer having a first acoustic impedance and a second layer formed on the first layer and having a second acoustic impedance lower than the first acoustic impedance.

33. The BAW resonator structure of claim 32 , wherein the first layer comprises silicon carbide and the second layer comprises non-etchable borosilicate glass.

34. The BAW resonator structure of claim 21 , wherein the substrate has a trench containing an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

35. The BAW resonator structure of claim 34 , further comprising a planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the planarization layer and the first electrode.

36. A bulk acoustic wave (BAW) resonator structure, comprising:

a substrate comprising a trench;

a first electrode disposed over the substrate;

a piezoelectric layer disposed over the first electrode;

a second electrode disposed over the piezoelectric layer; and

a collar structure disposed around a perimeter of an active region, which is defined by an overlap between the first electrode, the second electrode, the piezoelectric layer, and the trench, wherein the collar structure comprises a region of dielectric material having a predetermined thickness and width, and having a cutoff frequency substantially matched to a cutoff frequency of the active region.

37. The BAW resonator structure of claim 36 , wherein the collar structure has an inner edge that extends into the active region.

38. The BAW resonator structure of claim 36 , wherein the dielectric material comprises non-etchable borosilicate glass (NEBSG), carbon-doped silicon oxide (CDO), silicon carbide, silicon nitride, aluminum oxide, aluminum nitride, zinc oxide, or diamond.

39. The BAW resonator structure of claim 36 , wherein the dielectric material comprises carbon doped silicon oxide.

40. The BAW resonator structure of claim 36 , wherein the collar structure is formed between the substrate and the first electrode.

41. The BAW resonator structure of claim 36 , further comprising a planarization layer formed on the piezoelectric layer adjacent to the second electrode.

42. The BAW resonator structure of claim 36 , wherein the collar structure is formed over a planarization layer and the second electrode.

43. The BAW resonator structure of claim 42 , wherein the planarization layer comprises a first layer having a first acoustic impedance and a second layer formed on the first layer and having a second acoustic impedance lower than the first acoustic impedance.

44. The BAW resonator structure of claim 36 , wherein the substrate has a trench containing an air gap, and the first electrode is formed on the substrate over the air gap, and the collar structure extends into a region over the air gap.

45. The BAW resonator structure of claim 44 , further comprising a planarization layer formed on the substrate adjacent to the first electrode, wherein the collar structure is formed on the planarization layer and the first electrode.

46. The BAW resonator structure of claim 36 , wherein the collar structure further comprises an integrated frame.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 9,385,856 TO 9,385,756 PREVIOUSLY RECORDED AT REEL: 47349 FRAME: 001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 22, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 051144/0648 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE PREVIOUSLY RECORDED ON REEL 047229 FRAME 0408. ASSIGNOR(S) HEREBY CONFIRMS THE THE EFFECTIVE DATE IS 09/05/2018. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047349/0001 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047229/0408 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2012
From: BURAK, DARIUSZ; SHIRAKAWA, ALEXANDRE; CHOY, JOHN; NIKKEL, PHIL
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 029209/0289 →
Continuity (1)
Related Publication 20140118091A1 · May 1, 2014