Load lock with variable conductance valve
View Patent ↗A station for a disk processing system includes a load lock chamber, a variable conductance valve configured to connect the chamber to a vacuum pump, and valve controller. The valve controller may include a processor that controls an electromechanical actuator to adjust the conductance of the valve during the evacuation of the chamber.
1. A load lock, comprising:
a load lock chamber;
a variable conductance valve configured to connect the chamber to a vacuum pump; and
a valve controller having an electromechanical actuator configured to control the conductance of the valve.
2. The load lock of claim 1 wherein the valve comprises a butterfly valve.
3. The load lock of claim 1 wherein the valve includes at least three valve settings each having a different conductance.
4. The load lock of claim 1 wherein the valve controller is further configured to adjust the valve through at least three valve settings during an evacuation of the chamber, each of the at least three valve settings having a different conductance.
5. The load lock of claim 4 wherein the valve controller is further configured to control the time the valve remains at each of the at least three valve settings during the evacuation of the chamber.
6. The load lock of claim 1 wherein the valve controller comprises a processor having non-transitory machine readable media programmed with data, wherein the valve controller is further configured to control the conductance of the valve based on the programmed data.
7. A load lock, comprising:
a load lock chamber;
a variable conductance valve configured to connect the chamber to a vacuum pump; and
a valve controller comprising a processor having non-transitory machine readable media programmed with data, wherein the valve controller is configured to control the conductance of the valve based on the programmed data.
8. The load lock of claim 7 wherein the valve comprises a butterfly valve.
9. The load lock of claim 7 wherein the valve includes at least three valve settings each having a different conductance.
10. The load lock of claim 7 wherein the valve controller is further configured to adjust the valve through at least three valve settings during an evacuation of the chamber, each of the at least three valve settings having a different conductance.
11. The load lock of claim 10 wherein the valve controller is further configured to control the time the valve remains at each of the at least three valve settings during the evacuation of the chamber.
12. A method of evacuating a load lock chamber in a disk processing system, comprising:
introducing one or more substrates into the chamber; and
evacuating the chamber with a vacuum pump attached to the chamber through a variable conductance valve controlled by an electromechanical actuator.
13. The method of claim 12 further comprising removing the one or more substrates from the chamber after the chamber is evacuated.
14. The method of claim 13 further comprising venting the chamber after the one or more substrates are removed from the chamber.
15. The method of claim 12 wherein the evacuation of the chamber comprises adjusting the valve through at least three valve settings, each of the at least three valve settings having a different conductance.
16. The method of claim 15 wherein the evacuation of the chamber further comprises controlling the time the valve remains at each of the at least three valve settings.
17. The method of claim 12 wherein the evacuation of the chamber comprises adjusting the valve based on data stored on non-transitory machine readable media.
18. A method of evacuating a load lock chamber in a disk processing system, comprising:
introducing one or more substrates into the chamber; and
evacuating the chamber with a vacuum pump attached to the chamber through a variable conductance valve controlled by a processor based on data stored on non-transitory machine readable media.
19. The method of claim 18 further comprising removing the one or more substrates from the chamber after the chamber is evacuated.
20. The method of claim 19 further comprising venting the chamber after the one or more substrates are removed from the chamber.
21. The method of claim 18 wherein the evacuation of the chamber comprises adjusting the valve through at least three valve settings, each of the at least three valve settings having a different conductance.
22. The method of claim 21 wherein the evacuation of the chamber further comprises controlling the time the valve remains at each of the at least three valve settings.