Holder on chip module structure
View Patent ↗The present invention provides a holder on chip module structure including a substrate. A chip is configured on the substrate, with a sensing area. A holder is disposed on the substrate, wherein a portion of the holder is directly contacted to the chip to reduce the tilt between the chip and the holder. A transparent material is disposed on the holder, substantially aligning to the sensing area. A lens holder is disposed on the holder, and a lens is configured on the lens holder, substantially aligning to the transparent material and the sensing area.
1. A holder on chip module structure, comprising:
a substrate;
a chip configured on said substrate, with a sensing area;
a supporting holder disposed on said substrate, wherein a first portion of said supporting holder is directly contacted to said chip to reduce a tilt angle between said chip and said supporting holder, a second portion of said supporting holder is contacted to said substrate and without contacting said chip, wherein said first portion of said supporting holder is made of a softer material to avoid damaging a surface of said chip; and
a lens holder disposed on said supporting holder, and a lens configured on said lens holder, substantially aligning to said sensing area.
2. The module structure of claim 1 , wherein said supporting holder has a groove structure formed therein for allowing said chip disposed therein, and a through hole structure for exposing said sensing area of said chip.
3. The module structure of claim 2 , wherein said supporting holder has a ring groove structure located at a side of said through hole structure for a transparent plate disposed thereon.
4. The module structure of claim 1 , wherein said chip is adhered to said substrate via a first adhesion layer, said supporting holder adhered to said substrate via a second adhesion layer, and said lens holder adhered to said supporting holder via a third adhesion layer.
5. The module structure of claim 1 , wherein material of said first portion of said supporting holder is not the same as that of said second portion of said supporting holder.
6. The module structure of claim 1 , wherein said supporting holder is an integral structure.
7. The module structure of claim 1 , wherein said lens holder is a plastic piece or an actuator.
8. The module structure of claim 7 , wherein said actuator includes a voice coil motor or a micro electro mechanical system.
9. The module structure of claim 1 , further comprising a transparent material disposed on said supporting holder, substantially aligning to said sensing area.
10. The module structure of claim 9 , wherein said supporting holder has a groove structure formed therein for allowing said chip disposed therein, and a through hole structure for exposing said sensing area of said chip.
11. The module structure of claim 10 , wherein said supporting holder has a ring groove structure located at a side of said through hole structure for said transparent plate disposed thereon.
12. The module structure of claim 9 , wherein said chip is adhered to said substrate via a first adhesion layer, said supporting holder adhered to said substrate via a second adhesion layer, and said lens holder adhered to said supporting holder via a third adhesion layer.
13. The module structure of claim 9 , wherein material of said first portion of said supporting holder is not the same as that of said second portion of said supporting holder.
14. The module structure of claim 9 , wherein said supporting holder is an integral structure.
15. The module structure of claim 9 , wherein said lens holder is a plastic piece or an actuator.
16. The module structure of claim 15 , wherein said actuator includes a voice coil motor or a micro electro mechanical system.