IP Library Granted Patent US 8,618,606
Granted Patent B2
US 8,618,606 · App. 13/666,483 · Granted Dec 31, 2013

Semiconductor device

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Quick Facts
Patent No.
US 8,618,606
App. No.
13/666,483
Granted
Dec 31, 2013
Kind
B2
Abstract

Provided is a semiconductor device comprising: a PW layer formed at a surface of a semiconductor substrate; an NW layer formed at the surface of the semiconductor substrate to be in contact with the PW layer; a p+ base layer formed at the surface of the semiconductor substrate in the PW layer; an n+ collector layer formed at the surface of the semiconductor substrate in the NW layer; an n+ emitter layer located between the p+ base layer and the n+ collector layer and formed at the surface of the semiconductor substrate in the PW layer; and an n± layer formed between the n+ collector layer and the PW layer to be in contact with the n+ collector layer.

Claims (12)

1. A semiconductor device, comprising:

a semiconductor substrate;

a first layer of a first conductivity type formed at a surface of the semiconductor substrate and having an impurity concentration higher than an impurity concentration of the semiconductor substrate;

a second layer of a second conductivity type formed at the surface of the semiconductor substrate to be in contact with the first layer and having an impurity concentration higher than the impurity concentration of the semiconductor substrate;

a base layer of a first conductivity type formed at the surface of the semiconductor substrate in the first layer and having an impurity concentration higher than the impurity concentration of the first layer;

a collector layer of a second conductivity type formed at the surface of the semiconductor substrate in the second layer and having an impurity concentration higher than the impurity concentration of the second layer;

an emitter layer of the second conductivity type located between the base layer and the collector layer, formed at the surface of the semiconductor substrate in the first layer, and having an impurity concentration higher than the impurity concentration of the first layer; and

an electric field relaxation layer of a second conductivity type formed between the collector layer and the first layer to be in contact with the collector layer and having an impurity concentration lower than the impurity concentration of the collector layer and higher than the impurity concentration of the second layer.

2. A semiconductor device according to claim 1 , wherein the electric field relaxation layer is formed inside the second layer.

3. A semiconductor device according to claim 2 , wherein the collector layer is formed inside the electric field relaxation layer.

4. A semiconductor device according to claim 1 , wherein the electric field relaxation layer is formed to extend over the second layer and the first layer.

5. A semiconductor device according to claim 4 , wherein the collector layer is formed inside the electric field relaxation layer.

Assignments (4)
CHANGE OF ADDRESS Recorded Jun 8, 2023
From: ABLIC INC.
To: ABLIC INC.
Reel/Frame 064021/0575 →
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 037783 FRAME: 0166. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 23, 2016
From: SEIKO INSTRUMENTS INC
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 037903/0928 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2016
From: SEIKO INSTRUMENTS INC
To: SII SEMICONDUCTOR CORPORATION .
Reel/Frame 037783/0166 →