IP Library Granted Patent US 8,830,042
Granted Patent B2
US 8,830,042 · App. 13/668,962 · Granted Sep 9, 2014

Haptic feedback device

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Quick Facts
Patent No.
US 8,830,042
App. No.
13/668,962
Granted
Sep 9, 2014
Kind
B2
Abstract

There is provided a haptic feedback device. The haptic feedback device includes a vibration member; a vibration element formed on the vibration member to vibrate the vibration member; and a mass member formed on the vibration member to adjust a oscillation frequency of the vibration member, wherein one surface of the mass member facing the vibration member is formed to have a curved shape.

Claims (23)

1. A haptic feedback device comprising:

a vibration member;

a vibration element formed on the vibration member to vibrate the vibration member; and

a mass member formed on the vibration member to adjust an oscillation frequency of the vibration member,

wherein one surface of the mass member facing the vibration member is formed to have a curved shape, and

wherein the vibration member includes a first plate member to which the vibration element is fixedly attached and a second plate member extended from the first plate member and housing the mass member.

2. The haptic feedback device of claim 1 , wherein the one surface of the mass member is formed to have the curved shape having a smaller curvature than a radius of curvature formed when the vibration member is deformed by vibrations of the vibration element.

3. The haptic feedback device of claim 1 , wherein the second plate member is extended from a side surface of the first plate member, and is formed to be bent in a direction perpendicular to the first plate member.

4. The haptic feedback device of claim 1 , wherein the first plate member and the second plate member are integrally formed by press processing.

5. A haptic feedback device comprising:

a vibration member;

a vibration element formed on the vibration member to vibrate the vibration member;

a mass member formed on the vibration member to adjust an oscillation frequency of the vibration member; and

a shock absorbing member formed between the vibration member and the mass member to prevent contact between the vibration member and the mass member.

6. The haptic feedback device of claim 5 , wherein the shock absorbing member is formed on one surface of the vibration member.

7. The haptic feedback device of claim 5 , wherein the shock absorbing member is formed with the mass member.

8. The haptic feedback device of claim 5 , wherein one surface of the shock absorbing member is formed to have a curved shape.

9. A haptic feedback device comprising:

a vibration member;

a vibration element formed on the vibration member to vibrate the vibration member; and

a mass member formed on the vibration member to adjust an oscillation frequency of the vibration member,

wherein the vibration member includes a first plate member to which the vibration element is fixedly attached and a second plate member extended from the first plate member and housing the mass member, and

wherein one surface of the second plate member facing the first plate member is formed to have a curved shape.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2016
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: MPLUS CO., LTD.
Reel/Frame 037962/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2012
From: KIM, JAE KYUNG; PARK, DONG SUN; YUN, DAE WOONG; SON, YEON HO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 029368/0745 →