IP Library Granted Patent US 8,946,986
Granted Patent B2
US 8,946,986 · App. 13/669,222 · Granted Feb 3, 2015

Organic lighting device and lighting equipment

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,946,986
App. No.
13/669,222
Granted
Feb 3, 2015
Kind
B2
Abstract

An organic luminous means and an illumination device comprising such a luminous means are specified. An optical display apparatus, emergency lighting, motor vehicle interior lighting, an item of furniture, a construction material, a glazing and a display comprising such a luminous means and, respectively, comprising an illumination device having such a luminous means are furthermore specified.

Claims (43)

1. A method for producing a luminous means comprising the following steps:

providing a substrate having a first main surface and an active region,

applying a first electrode to the first main surface of the substrate,

applying an organic layer stack within the active region of the substrate on a side of the first electrode facing away from the first main surface of the substrate,

applying a second electrode on a side of the organic layer stack facing away from the first electrode,

applying an encapsulation for the organic layer stack against moisture and other atmospheric gases on a side of the second electrode facing away from the organic layer stack, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, wherein the encapsulation comprises a thin-film encapsulation which comprises a thin-film layer, and wherein the thin-film layer is applied by means of an atomic layer deposition, and

applying a protective lacquer layer on a side of thin-film encapsulation facing away from the substrate, wherein the protective lacquer layer comprises a plastic material.

2. The method of claim 1 , wherein the thin-film encapsulation comprises a plurality of alternating thin-film layers, and wherein at least two of said thin-film layers are different with regard to their material composition and are arranged in regular succession.

3. The method of claim 2 , wherein the thin-film encapsulation comprises thin-film layers of a first kind and thin-film layers of a second kind, and wherein the material composition of the thin-film layers of the first kind is different from the material composition of the thin-film layers of the second kind.

4. The method of claim 3 , wherein the thin-film layers of the first kind comprise silicon oxide and the thin-film layers of the second kind comprise silicon nitride.

5. The method of claim 1 ,

wherein the thin-film encapsulation comprises a plurality of thin-film layers,

wherein a first of said plurality of thin-film layers comprises a pinhole, and

wherein said pinhole is filled with material of a second of said plurality of thin-film layers.

6. The method of claim 1 , wherein the thin-film encapsulation comprises a plurality of thin-film layers and at least one interlayer, and wherein the interlayer is arranged between two of said plurality of thin-film layers.

7. The method of claim 6 , wherein said interlayer is applied by vapour-deposition.

8. The method of claim 1 , wherein an adhesion promoting layer is arranged between the thin-film encapsulation and the second electrode, said adhesion promoting layer comprising at least one of the following materials: sulfur atom, nitrogen atom, sulfur compound, nitrogen compound, aluminium oxide.

9. The method of claim 1 , wherein the thin-film encapsulation covers parts of the substrate which are outside the active region.

10. The method of claim 1 , wherein the thin-film encapsulation covers a side face of the organic layer stack.

11. The method of claim 1 , wherein the thin-film encapsulation covers a side face of the first electrode and a side face of the second electrode.

12. A luminous means comprising:

a substrate having a first main surface and an active region,

a first electrode on the first main surface of the substrate,

an organic layer stack within the active region of the substrate on a side of the first electrode facing away from the first main surface of the substrate,

a second electrode on a side of the organic layer stack facing away from the first electrode,

an encapsulation for the organic layer stack against moisture and other atmospheric gases on a side of the second electrode facing away from the organic layer stack, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, wherein the encapsulation comprises a thin-film encapsulation which comprises a thin-film layer, and wherein the thin-film layer is formed by an atomic layer deposition, and

a protective lacquer layer on a side of thin-film encapsulation facing away from the substrate, wherein the protective lacquer layer comprises a plastic material.

13. The luminous means of claim 12 , wherein the thin-film encapsulation comprises thin-film layers of a first kind and thin-film layers of a second kind, and wherein the material composition of the thin-film layers of the first kind is different from the material composition of the thin-film layers of the second kind.

14. The luminous means of claim 13 , wherein the thin-film layers of the first kind comprise silicon oxide and the thin-film layers of the second kind comprise silicon nitride.

15. The luminous means of claim 12 ,

wherein the thin-film encapsulation comprises a plurality of thin-film layers,

wherein a first of said plurality of thin-film layers comprises a pinhole, and

wherein said pinhole is filled with material of a second of said plurality of thin-film layers.

16. The luminous means of claim 12 , wherein an adhesion promoting layer is arranged between the thin-film encapsulation and the second electrode, said adhesion promoting layer comprising at least one of the following materials: sulfur atom, nitrogen atom, sulfur compound, nitrogen compound, aluminium oxide.

17. The luminous means of claim 12 , wherein the thin-film encapsulation covers parts of the substrate which are outside the active region.

18. The luminous means of claim 12 , wherein the thin-film encapsulation covers a side face of the organic layer stack, a side face of the first electrode and a side face of the second electrode.

19. A luminous means comprising:

a substrate having a first main surface and an active region,

a first electrode on the first main surface of the substrate,

an organic layer stack within the active region of the substrate on a side of the first electrode facing away from the first main surface of the substrate,

a second electrode on a side of the organic layer stack facing away from the first electrode,

an encapsulation for the organic layer stack against moisture and other atmospheric gases on a side of the second electrode facing away from the organic layer stack, wherein the organic layer stack comprises at least one organic layer which is suitable for generating light, wherein the encapsulation comprises a thin-film encapsulation which comprises a thin-film layer, wherein the thin-film layer is formed by an atomic layer deposition, wherein the thin-film encapsulation comprises a plurality of thin-film layers, wherein a first of said plurality of thin-film layers comprises a pinhole, wherein said pinhole is filled with material of a second of said plurality of thin-film layers, and wherein the thin-film encapsulation covers a side face of the organic layer stack, a side face of the first electrode and a side face of the second electrode, and

a protective lacquer layer on a side of thin-film encapsulation facing away from the substrate, wherein the protective lacquer layer comprises a plastic material.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2021
From: OSRAM SYLVANIA INC.
To: OSRAM OLED GMBH
Reel/Frame 057547/0956 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2020
From: OSRAM OLED GMBH
To: DOLYA HOLDCO 5 LIMITED
Reel/Frame 053464/0374 →
CORRECTIVE ASSIGNMENT TO CORRECT THE 11/658.772 REPLACED 11/658.772 PROPERTY NUMBERS PREVIOUSLY RECORDED AT REEL: 053464 FRAME: 0395. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Aug 11, 2020
From: DOLYA HOLDCO 5 LIMITED
To: PICTIVA DISPLAYS INTERNATIONAL LIMITED
Reel/Frame 053464/0395 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 24, 2016
From: WEITZEL, REINHARD
To: OSRAM OPTO SEMICONDUCTORS GMBH; OSRAM SYLVANIA INC.
Reel/Frame 038701/0129 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 21, 2016
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 037567/0993 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2012
From: DIEKMANN, KARSTEN; HEUSER, KARSTEN; KLEIN, MARKUS; LANG, DIETER; LECHERMANN, GEORG; REITHMEIER, MICHAEL; PLUMEYER, CARSTEN; CHIPALKATTI, MAKARAND; CUSTODIS, UDO; SEYMOUR, DIANE; POPLAVSKYY, DMYTRO
To: OSRAM OPTO SEMICONDUCTORS GMBH; OSRAM SYLVANIA INC.
Reel/Frame 029243/0112 →