Semiconductor device and manufacturing method thereof
View Patent ↗In a manufacturing method of a barrier layer, a via hole is formed in an insulating layer that covers a conductive layer over a substrate, and then the barrier layer is formed in the via hole. The barrier layer is provided by forming a second titanium nitride film after forming a first titanium nitride film. The second titanium nitride film is formed using a method having a weak anisotropy than the first titanium nitride film.
1. A semiconductor device comprising:
a conductive layer over a substrate;
an insulating layer covering the conductive layer;
a titanium film concealing at least a part of the conductive layer and covering a top surface of the insulating layer while not covering a side surface of the insulating layer in a via hole;
a first titanium nitride film including first and second portions, the first portion concealing the titanium film over the part of the conductive layer, the second portion extending along the side surface of the insulating layer in the via hole, the via hole being formed in the insulating layer exposing the part of the conductive layer, the first and second portions of the first titanium nitride film having different thicknesses;
a second titanium nitride film covering the first titanium nitride film at an upper part of the via hole; and
a conductive plug filling in the via hole through a barrier layer that includes the titanium film, the first titanium nitride film and the second titanium nitride film.
2. The semiconductor device according to claim 1 , wherein the second portion of the first titanium nitride film is thinner in thickness than the first portion of the first titanium nitride film.
3. The semiconductor device according to claim 2 , wherein a thickness of the second titanium nitride film at the upper part of the via hole gradually becomes thinner toward the part of the conductive layer.
4. The semiconductor device according to claim 2 , wherein the second titanium nitride film at the part of the conductive layer is thinner in thickness than the first titanium nitride film.
5. The semiconductor device according to claim 3 , wherein the thickness of the second titanium nitride film at the upper part of the via hole is thicker than the first titanium nitride film.
6. The semiconductor device according to claim 1 , wherein the conductive plug includes tungsten that comprises a seam near a center of the via hole.
7. The semiconductor device according to claim 1 , wherein the conductive layer is a copper layer.
8. The semiconductor device according to claim 1 , wherein the second portion of the first titanium nitride film is substantially completely formed on the side surface of the insulating layer in the via hole.
9. The semiconductor device according to claim 1 , wherein the conductive layer is an aluminum layer.