IP Library Granted Patent US 8,933,386
Granted Patent B2
US 8,933,386 · App. 13/669,858 · Granted Jan 13, 2015

Optical sensor device and method of manufacturing the same

Inventors: Hitoshi Kamamori (Chiba, JP); Sadao Oku (Chiba, JP); Hiroyuki Fujita (Chiba, JP); Koji Tsukagoshi (Chiba, JP); Keiichiro Hayashi (Chiba, JP)
Assignee: Seiko Instruments Inc.
G01J1/42H01L31/0203H01L2224/48091H01L2224/73265H01L2224/45147H01L2924/3025
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Quick Facts
Patent No.
US 8,933,386
App. No.
13/669,858
Granted
Jan 13, 2015
Kind
B2
Abstract

Provided is a high-reliability, compact, and low-cost optical sensor device. The optical sensor device includes a glass lid substrate ( 2 ), a glass substrate ( 9 ) with a cavity having divided and exposed through-hole electrodes ( 5 ) on the periphery thereof, and an optical sensor element ( 3 ) mounted on the glass lid substrate, and has a structure in which the glass lid substrate and the glass substrate with a cavity are bonded together. By hermetically sealing with the glass substrates, high reliability is secured. By using the divided through-hole electrodes, the package size is reduced and the number of devices which can be produced in a batch in the manufacture increases, which enables cost reduction.

Claims (25)

1. An optical sensor device, comprising:

a glass substrate with a cavity;

a glass lid substrate bonded to the glass substrate with the cavity;

a through-hole electrode dispose on an outside side surface of the glass substrate with the cavity;

a wiring electrode connected to the through-hole electrode, and disposed on an upper surface of the glass substrate with the cavity;

an external, electrode connected to the through-hole electrode, and disposed on a back surface of the glass substrate with the cavity; and

an optical sensor element mounted on any one of the glass lid substrate and the glass substrate with the cavity.

2. An optical sensor device according to claim 1 , wherein the through-hole electrode has a divided-into-four shape and is disposed at a corner of the glass substrate with the cavity.

3. An optical sensor device according to claim 1 , wherein the through-hole has a divided-into-two shape and is disposed on each of two opposite edges.

4. An optical sensor device according to claim 1 , wherein the glass substrate with a cavity comprises light shielding glass.

5. An optical sensor device according to claim 1 , wherein the glass lid substrate has a filter function.

6. A method of manufacturing an optical sensor device, comprising:

forming a conductive film in a predetermined pattern on a glass substrate, the glass substrate having a plurality of cavities and a plurality of through-holes on a periphery of the plurality of cavities;

patterning the conductive film in a predetermined shape;

mounting an optical sensor element on the patterned conductive film;

bonding with an adhesive a glass lid substrate and the glass substrate together; and

cutting the glass substrate and the glass lid substrate which are bonded together, at locations dividing the plurality of through-holes.

7. A method of manufacturing an optical sensor device, comprising:

forming a conductive trim on one surface of a glass lid substrate;

patterning in a predetermined shape the conductive film formed on the glass lid substrate;

mounting an optical sensor element on the patterned conductive film;

forming the conductive film on a glass substrate, the glass substrate having a plurality of cavities and a plurality of through-holes on a periphery or the plurality of cavities;

patterning in a predetermined shape the conductive film formed on the glass substrate;

bonding the glass rid substrate and the glass substrate together with an adhesive having conductive particles added thereto; and

cutting the glass substrate and the glass lid substrate which are bonded together, at locations dividing the plurality of through-holes.

Assignments (3)
CHANGE OF NAME Recorded Mar 12, 2018
From: SII SEMICONDUCTOR CORPORATION
To: ABLIC INC.
Reel/Frame 045567/0927 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2016
From: SEIKO INSTRUMENTS INC.
To: SII SEMICONDUCTOR CORPORATION
Reel/Frame 038058/0892 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2013
From: KAMAMORI, HITOSHI; OKU, SADAO; FUJITA, HIROYUKI; TSUKAGOSHI, KOJI; HAYASHI, KEIICHIRO
To: SEIKO INSTRUMENTS INC.
Reel/Frame 029845/0490 →
Priority Claims (1)
JP 2011-246671 · Nov 10, 2011 · national
Continuity (1)
Related Publication 20130134300A1 · May 30, 2013