Light-emitting device and manufacturing method
View Patent ↗A light-emitting device comprises a substrate, a light-emitting layer, a wire formed on the substrate and supplying electric power to the light-emitting layer; a transition metal oxide layer formed on the substrate and over the wire; a bank formed on the transition metal oxide layer defining an opening over the wire; an interception layer formed on a portion of the transition metal oxide layer that is exposed through the opening and intercepting migrating fluorine; an organic layer formed on the interception layer and doped with an alkali metal; and an electrode formed on the organic layer, electrically connected to the wire via the organic layer, the interception layer, and the transition metal oxide layer, and providing the electric power supplied by the wire to the organic layer.
1. A light-emitting device, comprising:
a substrate;
both a wire and a pixel electrode formed on the substrate, wherein the wire and pixel electrode are separated from each other in a plan view;
a transition metal oxide layer formed on both the wire and the pixel electrode;
a bank formed on the transition metal oxide layer so as to define a first opening above the pixel electrode and a second opening above the wire, a portion of the transition metal oxide layer being exposed at a bottom of the first opening, and a portion of the transition metal oxide layer being exposed at a bottom of the second opening;
a light-emitting layer formed above the portion of the transition metal oxide layer that is exposed at the bottom of the first opening, and wherein the light-emitting layer is not formed above the portion of the transition metal oxide layer that is exposed at the bottom of the second opening;
an interception layer formed on the portion of the transition metal oxide layer that is exposed at the bottom of the second opening, and intercepting migrating fluorine, and wherein the interception layer is not formed above the portion of the transition metal oxide layer that is exposed at the bottom of the first opening;
an organic layer formed on the interception layer and the light-emitting layer, and doped with an alkali metal; and
a common electrode formed on the organic layer so as to be seamless at least from an area above the interception layer to an area above the light-emitting layer,
wherein the common electrode is electrically connected to the wire via the transition metal oxide layer, the interception layer, and the organic layer.
2. The light-emitting device of claim 1 , wherein
the organic layer has a base material that is an organic material having electron transport properties.
3. The light-emitting device of claim 1 , wherein
the pixel electrode is formed on the substrate so as to be coplanar with the wire, and
the pixel electrode is interposed between the substrate and the transition metal oxide layer.
4. The light-emitting device of claim 3 , wherein
the transition metal oxide layer formed over the wire and the transition metal oxide layer formed over the pixel electrode are contiguous.
5. The light-emitting device of claim 1 , wherein
the interception layer is also formed on an inner wall of the opening in the bank.
6. The light-emitting device of claim 1 , wherein
the interception layer includes a material that is identical to the transition metal oxide layer.
7. The light-emitting device of claim 6 , wherein
the interception layer has a thickness of at least 3 nm to at most 10 nm.
8. The light-emitting device of claim 1 , wherein
the interception layer is formed from an alkali metal fluoride material.
9. The light-emitting device of claim 8 , wherein
the alkali metal fluoride material is sodium fluoride.
10. The light-emitting device of claim 8 , wherein
the interception layer has a thickness of at least 2 nm to at most 5 nm.
11. The light-emitting device of claim 1 , wherein
the interception layer includes one of Al, Ag, Mg, and Ta.
12. The light-emitting device of claim 1 , wherein
the transition metal layer includes one of Mo, W, Ti, In, Sn, Zn, and Ni.
13. A light-emitting device manufacturing method, comprising:
forming an insulation layer over a TFT substrate;
forming both a wire and a pixel electrode on the insulation layer so as to be separated from each other in a plan view;
forming a transition metal oxide layer on both the wire and the pixel electrode;
forming a bank on the transition metal oxide layer so as to define a first opening above the pixel electrode and a second opening above the wire, a portion of the transition metal oxide layer being exposed at a bottom of the first opening, and a portion of the transition metal oxide layer being exposed at a bottom of the second opening;
forming a light-emitting layer above the portion of the transition metal oxide layer that is exposed at the bottom of the first opening, and wherein the light-emitting layer is not formed above the portion of the transition metal oxide layer that is exposed at the bottom of the second opening;
forming an interception layer on the portion of the transition metal oxide layer that is exposed at the bottom of the second opening, the interception layer intercepting migrating fluorine, and wherein the light-emitting layer is not formed above the portion of the transition metal oxide layer that is exposed at the bottom of the second opening;
forming an organic layer doped with an alkali metal on the interception layer and the light-emitting layer; and
forming a common electrode on the organic layer so as to be seamless at least from an area above the interception layer to an area above the light-emitting layer,
wherein the wire and the common electrode are electrically connected to each other via the transition metal oxide layer, the interception layer, and the organic layer.
14. The light-emitting device manufacturing method of claim 13 , wherein
in forming the wire and the pixel electrode, the pixel electrode is formed on the insulation layer so as to be coplanar with the wire, and
in forming the interception layer, the interception layer is formed so as to extend over the pixel electrode.
15. The light-emitting device manufacturing method of claim 14 , wherein
in forming the transition metal oxide layer, the transition metal oxide layer is formed over the entirety of the wire and the pixel electrode.
16. The light-emitting device manufacturing method of claim 13 , wherein
in forming the interception layer, the interception layer is also formed on an inner wall of the opening in the bank.
17. The light-emitting device manufacturing method of claim 13 , wherein
in forming the interception layer, the interception layer is formed using a material that is identical to the transition metal oxide layer.
18. The light-emitting device of claim 1 ,
wherein the first opening is formed with separation from the second opening, as seen in a plan view,
wherein the interception layer is selectively formed within the second opening, and
wherein the light-emitting layer is formed within the first opening.
19. The light-emitting device manufacturing method of claim 13 ,
wherein the first opening is formed with separation from the second opening, as seen in a plan view,
wherein the interception layer is selectively formed within the second opening, and
wherein the light-emitting layer is formed within the first opening.