Treatment of filaments or yarn
View Patent ↗A method for treating an aromatic polyamide filament or yarn to improve its adhesion to rubber wherein, the method comprises exposing the filament or yarn to a first mixture of reagents comprising multi-functional isocyanate oligomers and multi-functional epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the mixture is in the range of from 0.8 to 1.2, and heating the exposed filament or yarn to a temperature of at least 100 degrees C. whereby the epoxy and isocyanate oligomers cross-link and form a network on the surface of the filament or yarn.
1. A method for treating a filament or yarn comprising:
(a) forming a mixture of reagents comprising multi-functional isocyanate oligomers and epoxy oligomers, wherein the ratio of total isocyanate groups to total epoxy groups in the mixture is in the range of from 0.8 to 1.2,
(b) dipping the filament or yarn into the mixture of reagents,
(c) removing solvent from the dipped filament or yarn, and
(d) dipping the filament or yarn from step (c) into a catalyst whereby the isocyanate oligomers and the epoxy oligomers react to cross-link and form a network on the surface of the filament or yarn, with the proviso that double bonds present in the epoxy and isocyanate oligomers do not participate in the crosslinking reaction.
2. The method of claim 1 , wherein the filament or yarn is in a form selected from the group consisting of a cord and a fabric.
3. The method of claim 1 wherein the filament or yarn is synthetic and selected from the group consisting of an aromatic polyamide, an aromatic copolyamide, an aliphatic polyamide and polyester.
4. The method of claim 1 wherein the filament or yarn is natural and is selected from the group consisting of cotton and cellulose.
5. The method of claim 3 , wherein the aromatic polyamide is para-aramid.