Coating and electronic component
A coating for a conductor, the coating having a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more, which means 65% or more of the crystal planes of the palladium layer are aligned to this crystal plane. Preferably the crystal plane whose orientation rate is 65% or more in the coating is the (111) plane or (200) plane.
1. An electronic component comprising a signal transfer unit, the signal transfer unit comprising:
a substrate;
a conductor bonded to the substrate; and
a coating covering the conductor;
wherein the coating comprises a palladium layer having a crystal plane whose orientation rate is 65% or more, and wherein the crystal plane whose orientation rate is 65% or more is a (111) plane or (200) plane.
2. The electronic component according to claim 1 , wherein the palladium layer contains phosphorus in a concentration ranging from 0.5% by mass to 2.5% by mass.
3. The electronic component according to claim 1 , further comprising a gold layer on the opposite surface of the palladium layer to the conductor.
4. The electronic component according to claim 1 , further comprising a metal underlayer between the palladium layer and the conductor.
5. The electronic component according to claim 4 , wherein the metal underlayer includes at least one metal selected from the group consisting of Ni, Sn, Fe, Co, Zn, Rh, Ag, Pt, Au, Pb, and Bi.
6. The electronic component according to claim 4 , wherein the metal underlayer contains Ni.
7. The electronic component according to claim 3 , further comprising a metal underlayer between the palladium layer and the conductor.
8. The electronic component according to claim 7 , wherein the metal underlayer includes at least one metal selected from the group consisting of Ni, Sn, Fe, Co, Zn, Rh, Ag, Pt, Au, Pb, and Bi.
9. The electronic component according to claim 7 , wherein the metal underlayer contains Ni.
10. The electronic component according to claim 1 , wherein:
the conductor is copper; and
the palladium layer is formed by immersing the conductor in a palladium plating solution.
11. The electronic component according to claim 10 , wherein a temperature of the palladium plating solution is 55° C.
12. The electronic component according to claim 10 , wherein the palladium plating solution comprises:
diammine palladium nitrite;
disodium ethylenediaminetetraacetate;
sodium hydrogen phosphite; and
sodium formate.
13. The electronic component according to claim 10 , wherein:
a surface of the conductor is activated before the conductor is immersed in the palladium plating solution; and
the surface of the conductor is activated by immersing the conductor in an activator liquid.
14. The electronic component according to claim 13 , wherein the activator liquid comprises:
palladium sulfate; and
ammonium nitrate.
15. An electronic component comprising a signal transfer unit, the signal transfer unit comprising:
a substrate;
a conductor bonded to the substrate; and
a coating covering the conductor;
wherein:
the coating comprises a palladium layer having a crystal plane whose orientation rate is 65% or more, wherein the crystal plane whose orientation rate is 65% or more is a (111) plane or (200) plane; and
the substrate is a glass epoxy substrate.
16. A signal transfer unit comprising:
a conductor; and
a coating covering the conductor;
wherein the coating comprises a palladium layer having a crystal plane whose orientation rate is 65% or more, and wherein the crystal plane whose orientation rate is 65% or more is a (111) plane or (200) plane.
17. The signal transfer unit according to claim 16 , wherein the palladium layer contains phosphorus in a concentration ranging from 0.5% by mass to 2.5% by mass.