IP Library Granted Patent US 8,791,798
Granted Patent B2
US 8,791,798 · App. 13/677,932 · Granted Jul 29, 2014

Haptic feedback device

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Quick Facts
Patent No.
US 8,791,798
App. No.
13/677,932
Granted
Jul 29, 2014
Kind
B2
Abstract

There is provided a haptic feedback device, including: a vibrating member coupled to a fixed body; and a vibrating element formed on the vibrating member to vibrate the vibrating member, wherein the vibrating member has a plurality of fixed points coupled to the fixed body while allowing a length thereof, vibrated by the vibrating element, to be changed.

Claims (47)

1. A haptic feedback device, comprising:

a vibrating member coupled to a fixed body; and

a vibrating element formed on the vibrating member to vibrate the vibrating member,

wherein the vibrating member and the fixed body are coupled at a plurality of fixed points able to be variably positioned to allow a length of the vibrating member, vibrated by the vibrating element, to be changed.

2. The haptic feedback device of claim 1 , wherein the plurality of fixed points are formed in a length direction of the vibrating member.

3. The haptic feedback device of claim 1 , wherein the plurality of fixed points are welding points at which the vibrating member is bonded to the fixed body.

4. The haptic feedback device of claim 1 , wherein the plurality of fixed points are holes formed in the vibrating member.

5. The haptic feedback device of claim 1 , wherein the plurality of fixed points are grooves formed in end portions of the vibrating member.

6. The haptic feedback device of claim 1 , further comprising a first mass member provided to the vibrating member.

7. The haptic feedback device of claim 6 , wherein the first mass member has a coupling structure so as to be coupled to a second mass member.

8. The haptic feedback device of claim 7 , wherein the first mass member includes an insertion hole into which the second mass member is inserted.

9. The haptic feedback device of claim 7 , wherein the first mass member includes a protrusion or a groove so as to be coupled to the second mass member, and

the second mass member includes a groove or a protrusion corresponding to the protrusion or the groove of the first mass member.

10. The haptic feedback device of claim 7 , wherein the second mass member is an adhesive having a predetermined mass, and

the first mass member includes a receiving space for the adhesive.

11. A haptic feedback device, comprising:

a vibrating member; and

a vibrating element formed on the vibrating member to vibrate the vibrating member,

wherein the vibrating member has a structure in which a plurality of vibrating plates are connected in parallel in a width direction of the vibrating member.

12. The haptic feedback device of claim 11 , wherein the vibrating member is divided into the plurality of vibrating plates by a separating groove extending in a length direction of the vibrating member.

13. The haptic feedback device of claim 11 , wherein the plurality of vibrating plates are provided with a plurality of holes in a length direction thereof.

14. The haptic feedback device of claim 11 , wherein the plurality of vibrating plates are integrally formed with the vibrating member by a pressing process.

15. The haptic feedback device of claim 11 , further comprising a first mass member provided to the vibrating member.

16. The haptic feedback device of claim 15 , further comprising a second mass member having a predetermined mass,

wherein the second mass member is an adhesive so as to be bonded to the first mass member.

17. The haptic feedback device of claim 15 , wherein the first mass member has a coupling structure so as to be coupled to the second mass member.

18. The haptic feedback device of claim 17 , wherein the first mass member includes an insertion hole into which the second mass member is inserted.

19. The haptic feedback device of claim 17 , wherein the first mass member includes a protrusion or a groove so as to be coupled to the second mass member, and

the second mass member includes a groove or a protrusion corresponding to the protrusion or the groove of the first mass member.

20. A haptic feedback device, comprising:

a vibrating member;

a vibrating element formed on the vibrating member to vibrate the vibrating member;

a first mass member provided to the vibrating member; and

a second mass member selectively coupled to the first mass member.

21. The haptic feedback device of claim 20 , wherein the first mass member includes an insertion hole into which the second mass member is inserted.

22. The haptic feedback device of claim 20 , wherein the first mass member includes a protrusion or a groove so as to be coupled to the second mass member, and

the second mass member includes a groove or a protrusion corresponding to the protrusion or the groove of the first mass member.

23. The haptic feedback device of claim 20 , wherein the vibrating member includes:

a first plate member elongated in a first direction; and

a pair of second plate members extended from both sides of the first plate member and bent in a second direction perpendicular to the first direction so as to be coupled to the first mass member.

24. The haptic feedback device of claim 20 , further comprising an upper case and a lower case receiving the first mass member and the vibrating member.

25. The haptic feedback device of claim 24 , wherein the upper case includes a receiving groove.

26. The haptic feedback device of claim 25 , wherein the second mass member having a predetermined mass and being curable at room temperature is provided in the first mass member through the receiving groove.

27. A haptic feedback device, comprising:

a vibrating member coupled to a fixed body while having a first vibrating length due to a first fixed point;

a vibrating element formed on the vibrating member to vibrate the vibrating member; and

at least one second fixed point at which the vibrating member is coupled to the fixed body while having a second vibrating length different from the first vibrating length.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2016
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: MPLUS CO., LTD.
Reel/Frame 037962/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2012
From: SON, YEON HO; PARK, DONG SUN; KIM, JAE KYUNG; YUN, DAE WOONG
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 029305/0171 →