STRUCTURE BODY AND ELECTRONIC COMPONENT AND PRINTED WIRING BOARD INCLUDING THE SAME
This structure body includes a conductor comprising Cu as a main component, an intermediate layer formed on the conductor, and a protective layer formed on the intermediate layer, the intermediate layer includes at least Cu, Sn, Ni, and P, and the protective layer includes at least Ni and P.
1 . A structure body comprising:
a conductor including Cu as a main component;
an intermediate layer formed on the conductor; and
a protective layer formed on the intermediate layer, wherein
the intermediate layer includes at least Cu, Sn, Ni, and P, and
the protective layer includes at least Ni and P.
2 . The structure body according to claim 1 , wherein a maximum value of the Sn concentration of the intermediate layer is 5 (at. %) or more and 50 (at. %) or less.
3 . The structure body according to claim 1 , wherein an average value of the P concentration of the intermediate layer is smaller than an average value of the P concentration of the protective layer.
4 . The structure body according to claim 2 , wherein an average value of the P concentration of the intermediate layer is smaller than an average value of the P concentration of the protective layer.
5 . The structure body according to claim 3 , wherein the average value of the P concentration of the intermediate layer is 2 (at. %) or more and 19 (at. %) or less.
6 . The structure body according to claim 4 , wherein the average value of the P concentration of the intermediate layer is 2 (at. %) or more and 19 (at. %) or less.
7 . The structure body according to claim 1 , wherein the intermediate layer has a thickness of 0.05 μm or more and 0.5 μm or less.
8 . The structure body according to claim 1 , wherein the protective layer has a thickness of 0.1 μm or more and 5 μm or less.
9 . The structure body according to claim 1 , further comprising a surface electrode layer formed on the protective layer.
10 . An electronic component comprising the structure body according to claim 1 .
11 . A printed wiring board comprising the structure body according to claim 1 .