HEAT TRANSFER SUBSYSTEM INTERCONNECTION ARRANGEMENTS FOR INFORMATION TECHNOLOGY
Arrangements for heat transfer subsystem interconnection for use in information technology and other heat-producing equipment are disclosed. The arrangements provide for plurality of individual subsystems, each having a thermal interface. These are configured so that two or more of the subsystems can be thermally interconnected by connecting their thermal interfaces. Each subsystem may comprise at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator. The thermoelectric device can incorporate quantum-process and quantum-well materials for higher heat transfer and thermoelectric generation efficiencies. In some implementations, the thermoelectric device is comprised by the thermal interface. In some implementations, a control system and electronics are used to selectively configure the thermoelectric device in either a thermoelectric cooler operating mode or in a thermoelectric generation operating mode.
1 . A system for heat transfer subsystem interconnection, the system comprising:
a first subsystem comprising at least a first thermal interface for heat transfer;
a second subsystem comprising at least a second thermal interface for heat transfer; and
a thermal interconnection between the first thermal interface and the second thermal interface;
wherein at least one of the first thermal interface and the second thermal interface comprises a thermoelectric device, and
wherein the two subsystems provide coordinated cooling and energy harvesting functions.
2 . The system of claim 1 , at least one of the first and the second subsystems comprising at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator.
3 . The system of claim 2 , wherein the at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator comprises quantum-process thermoelectric material.
4 . The system of claim 1 , wherein the at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator comprises quantum-well thermoelectric material.
5 . The system of claim 1 , wherein the thermal interconnection comprises fastener-facilitated thermal contact.
6 . The system of claim 1 , wherein the thermal interconnection comprises a pressure-contact arrangement.
7 . The system of claim 1 , wherein the thermal interconnection comprises a mating arrangement.
8 . The system of claim 1 , wherein the first and second subsystems operate in a peer relationship.
9 . The system of claim 1 , wherein the first and second subsystems operate in a hierarchical relationship.
10 . The system of claim 1 , wherein the system multiplexes the operating mode of the at least one of the thermoelectric devices among at least two of a cooling mode, an energy-harvesting mode, and a temperature sensing mode.
11 . The system of claim 1 , wherein the system adaptively switches the operating mode of at least one of the at least one thermoelectric devices among at least two of a cooling mode, an energy-harvesting mode, and a temperature sensing mode.
12 . The system of claim 1 , wherein the at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator is in thermal contact with an integrated circuit chip.
13 . The system of claim 1 , wherein the at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator is in thermal contact with a circulating cooling fluid arrangement, the circulating cooling fluid arrangement in thermal contact with at least one integrated circuit chip.
14 . The system of claim 1 , wherein the at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator is in thermal contact with a heat pipe arrangement, the heat pipe arrangement in thermal contact with at least one integrated circuit chip.
15 . The system of claim 1 , wherein the at least one thermoelectric device capable of acting as a thermoelectric cooler and as a thermoelectric generator is in thermal contact with a micro-droplet cooling arrangement, the micro-droplet cooling arrangement in thermal contact with at least one integrated circuit chip.
16 . The system of claim 1 , wherein each of the first and second subsystems comprises a closed system of circulating thermal transfer fluids.
17 . The system of claim 16 , further comprising at least two closed circulating fluid cooling systems that are thermally linked by the thermal interconnection.
18 . The system of claim 1 , wherein at least one of the first and second subsystems comprises a backup fan to expel heat.
19 . The system of claim 1 , wherein one of the first and second subsystems comprises a circuit board.
20 . The system of claim 1 , wherein one of the first and second subsystems comprises a chassis.
21 . The system of claim 1 , wherein one of the first and second subsystems comprises a cage.
22 . The system of claim 1 , wherein one of the first and second subsystems comprises a rack.
23 . The system of claim 17 , further comprising a thermoelectric device at a thermal interface between the two closed loop fluid cooling systems.