IP Library Granted Patent US 8,728,240
Granted Patent B2
US 8,728,240 · App. 13/680,331 · Granted May 20, 2014

Apparatus for vapor condensation and recovery

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,728,240
App. No.
13/680,331
Granted
May 20, 2014
Kind
B2
Abstract

Methods and apparatus for recovery of precursor vapor from a gas and precursor vapor mixture used in a deposition process. The gas and precursor vapor mixture is passed through a multitude of heat transfer surfaces in a heat conducting housing causing the precursor vapor to condense. The precursor vapor in liquid form is then collected after condensation.

Claims (4)

1. An apparatus for recovery of precursor vapor from a gas and precursor vapor mixture used for deposition in a semiconductor fabrication process, the apparatus comprising a vacuum tight housing with an inlet for said gas and precursor vapor mixture to flow into the housing, a first outlet for gas of the gas and precursor vapor mixture to flow out of the housing, and a second outlet for a precursor liquid formed from precursor vapor condensation to be discharged from the housing, said housing having a multitude of internal heat conducting surfaces for heat transfer inside said housing and having a multitude of heat conducting surfaces for heat dissipation outside said housing, said housing being maintained at a temperature sufficient for said precursor vapor to condense and form the precursor liquid by a cooler in thermal contact with the housing and the housing positioned between the internal heat conducting surfaces and the heat conducting surfaces outside of said housing such that the cooler is in thermal contact with both the internal heat conducting surfaces and the heat conducting surfaces for dissipation outside said housing.

2. The apparatus of claim 1 wherein the cooler is a thermoelectric cooler for controlling said temperature of said housing to a selected value for condensing said precursor vapor to form the precursor liquid.

3. The apparatus of claim 1 said housing is made of a heat-conducting metal.

4. The apparatus of claim 3 said metal is aluminum.

Assignments (2)
GUARANTOR JOINDER AND ASSUMPTION AGREEMENT Recorded Nov 14, 2016
From: MSP CORPORATION
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 040613/0331 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2012
From: LIU, BENJAMIN Y.H.; DINH, THUC M.; MA, YAMIN
To: MSP CORPORATION
Reel/Frame 029335/0001 →