Highly conductive composites
Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and/or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and/or electrical conducting pathway effectively enhances the thermal and/or electrical conductivity of the composite with significantly less amount of filler.
1. A process for assembling a system having enhanced thermal conductivity, comprising:
providing an integrated circuit and a heat sink; and
forming a multi-component thermal conductor therebetween, wherein the multi-component thermal conductor comprises a multicomponent material comprising:
a first component comprising a polymer matrix, which is a first phase;
a second component comprising a low melting point material immiscible with the first component; and
a third component comprising a filler material with higher thermal conductivity than the first and second components;
wherein the third component is dispersed into the second component to form a second phase, and the second phase is dispersed within the first phase,
said second phase being segregated into domains within said first phase;
wherein said third component is percolated within the second phase; and
wherein the second phase is percolated within the first phase.
2. The process of claim 1 , wherein the multi-component thermal conductor further comprises a capped particle.
3. The process of claim 2 , wherein the cap material is miscible with the second component, but not the first component.
4. The process according to claim 3 , wherein the particle has a high aspect ratio.
5. The process according to claim 3 , wherein the particle imparts improved thermal conductivity to the multi-component material.
6. The process according to claim 2 , wherein the particle is nano-sized in at least one dimension.
7. The process according to claim 2 , wherein the particle is not nano-sized in any dimension.
8. The process according to claim 2 , wherein the particle is a semiconductor.
9. The process according to claim 2 , wherein the particle is a metal.
10. The process according to claim 1 , wherein the multi-component material has an intended application and the melting point of the second component is substantially at or below the expected operating temperature range of the intended application.
11. The process according to claim 1 , wherein the multi-component material has an intended application and the melting point of the first component is substantially above the operating temperature range of the intended application.
12. The process according to claim 1 , wherein the first component is an adhesive.
13. The process according to claim 1 , wherein the first component is one of thermoset polymer, thermoplastic polymer, rubber polymer, block co-polymer or polymer blend.
14. The process according to claim 1 , wherein the second component is a material selected from the group consisting of: poly(acrylonitrile-butadiene-styrene) (ABS), poly(methyl methacrylate) (PMMA), celluloid, cellulose acetate, poly(ethylene-vinyl acetate) (EVA), poly(ethylene vinyl alcohol) (EVOH), fluoroplastics, polyacrylates (Acrylic), polyacrylonitrile (PAN), polyamide (PA or Nylon), polyamide-imide (PAI), polyaryletherketone (PAEK), polybutadiene (PBD), polybutylene (PB), polybutylene terephthalate (PBT), polycaprolactone (PCL), polychlorotrifluoroethylene (PCTFE), polyethylene terephthalate (PET), polycyclohexylene dimethylene terephthalate (PCT), polycarbonate (PC), polyhydroxyalkanoates (PHAs), polyketone (PK), polyester, polyethylene (PE), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), polyetherimide (PEI), polyethersulfone (PES), polyethylenechlorinates (PEC), polyimide (PI), polylactic acid (PLA), polymethylpentene (PMP), polyphenylene oxide (PPO), polyphenylene sulfide (PPS), polyphthalamide (PPA), polypropylene (PP), polystyrene (PS), polysulfone (PSU), polytrimethylene terephthalate (PTT), polyurethane (PU), polyvinyl acetate (PVA), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC), and poly(styrene-acrylonitrile) (SAN).
15. The process according to claim 1 , wherein the filler material is selected from the group consisting of: C, Ag, Au, Cu, Ni, Pt, Pd, Fe, Pb, Al, Zn, Co, Dy, Gd, ZnO, SiO2, BN, AIN, GaN, AlxGa1-xN, Al2O3, FeO, Fe2O3, Fe3O4, TiO2, MgO, EuO, and CrO2.
16. The process according to claim 1 , wherein said filler material comprises particles having shapes in the form of spheres, clusters, rods, whiskers, flakes, and wires.
17. The process according to claim 1 , further comprising:
a fourth component comprising a further filler material miscible in the first component and immiscible in the second component.
18. A process of making a multi-component material comprising:
a first component comprising a polymer matrix, which is a first phase;
a second component comprising a low melting point material immiscible with the first component; and
a third component comprising a filler material with higher thermal conductivity than the first and second components;
wherein the third component is dispersed into the second component to form a second phase, and the second phase is dispersed within the first phase,
said second phase being segregated into domains within said first phase;
wherein said third component is percolated within the second phase; and
wherein the second phase is percolated within the first phase, said process comprising: providing the first component and the second component; capping filler particles with capping agents immiscible with the polymeric matrix and miscible in the low melting point material to provide the filler material; dispersing the third component in the second component; creating a mixture by combining the first component and the second component, said second component containing the third component dispersed therein; and forming a multi-component material from the mixture.
19. The process according to claim 18 , wherein the forming comprises coating a surface and heating the coating.
20. The process according to claim 19 , wherein the coating comprises one of dipping, spinning, spraying, brushing, sputtering, painting, or printing.
21. The process according to claim 18 , wherein the forming comprises heating and extruding the mixture.
22. The process according to claim 18 , wherein the forming comprises heating and injection molding the mixture.
23. The process according to claim 18 , wherein the forming comprises heating and compression molding the mixture.
24. The process according to claim 18 , wherein the forming comprises heating and resin transfer molding the mixture.
25. The process according to claim 18 , wherein the forming comprises heating and laminating the mixture.
26. A process of making a multi-component material comprising:
a first component comprising a polymer matrix, which is a first phase;
a second component comprising a low melting point material immiscible with the first component; and
a third component comprising a filler material with higher thermal conductivity than the first and second components;
wherein the third component is dispersed into the second component to form a second phase, and the second phase is dispersed within the first phase,
said second phase being segregated into domains within said first phase;
wherein said third component is percolated within the second phase; and
wherein the second phase is percolated within the first phase, said process, said material being a fluid for use in manufacturing thermally enhanced layers, said process comprising: providing the first component and the second component; capping filler particles with capping agents immiscible with the polymeric matrix and miscible in the low melting point material to provide the filler material; dispersing the third component in the second component; and creating a mixture by combining the first component and the second component, said second component containing the third component dispersed therein.
27. An integrated circuit and heat sink formed by the process of claim 1 .
28. A process for assembling a system having enhanced thermal conductivity, comprising:
providing an integrated circuit and a heat sink; and
forming a multi-component thermal conductor therebetween,
wherein the multi-component thermal conductor comprises a multicomponent material comprising:
a polymer matrix;
a low melting point material immiscible with the polymer matrix; and
a filler material with higher thermal conductivity than the polymer matrix and the low melting point material;
wherein the filler material is dispersed into the low melting point material and the low melting point material containing the filler material is dispersed within the polymer matrix, wherein said low melting point material containing the filler material is segregated into domains within the polymer matrix, said filler material is percolated within the dispersion of filler material within the low melting point material, and said low melting point material containing the filler material is percolated within the polymer matrix.
29. A process of making a multicomponent material comprising
a polymer matrix;
a first material immiscible with the polymer matrix; and
a filler material with higher thermal conductivity than the polymer matrix and the first material;
wherein the filler material is dispersed into the low melting point material and the low melting point material containing the filler material is dispersed within the polymer matrix, wherein said low melting point material containing the filler material is segregated into domains within the polymer matrix, said filler material is percolated within the dispersion of filler material within the low melting point material, and said low melting point material containing the filler material is percolated within the polymer matrix
the process comprising: providing the first component and the second component; capping filler particles with capping agents immiscible with the polymeric matrix and miscible in the low melting point material to provide the filler material; dispersing the third component in the second component; creating a mixture by combining the first component and the second component, said second component containing the third component dispersed therein; and forming the multi-component material from the mixture.
30. The process according to claim 29 , wherein the forming comprises coating a surface and heating the coating.
31. The process according to claim 30 , wherein the coating comprises one of dipping, spinning, spraying, brushing, sputtering, painting, or printing.
32. The process according to claim 29 , wherein the forming comprises heating and extruding the mixture.
33. The process according to claim 29 , wherein the forming comprises heating and injection molding the mixture.
34. The process according to claim 29 , wherein the forming comprises heating and compression molding the mixture.
35. The process according to claim 29 , wherein the forming comprises heating and resin transfer molding the mixture.
36. The process according to claim 29 , wherein the forming comprises heating and laminating the mixture.