Semiconductor device
View Patent ↗Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.
1. A semiconductor device comprising:
an electrode pad having a probe region and a non-probe region,
a pad metal disposed under the probe region, the pad metal electrically connected to the electrode pad, and
a metal layer disposed under the non-probe region,
wherein the pad metal and the metal layer are disposed in a same layer, and
a plurality of the electrode pads are arranged in a zigzag pattern.
2. The device of claim 1 , wherein the electrode pad and the pad metal are connected by a connector.
3. The device of claim 2 , wherein the connector is made of metal.
4. The device of claim 3 , wherein the connector is smaller than the pad metal.
5. The device of claim 4 , wherein an interlayer insulating film is disposed between the electrode pad and the metal layer.
6. The device of claim 5 , wherein the plurality of electrode pads surround an internal circuit in plan view.
7. The device of claim 6 , further comprising a bump disposed on the electrode pad.
8. The device of claim 7 , wherein the metal layer is not electrically connected to the electrode pad.
9. The device of claim 8 , wherein the probe region is placed in a region within 20 μm from a center line of the electrode pad extending substantially in parallel with a longitudinal axis of the metal layer, and the non-probe region is placed in a region of the electrode pad other than the probe region.
10. The device of claim 1 , wherein there is no other metal layer disposed between said metal layer and said electrode pad.
11. A semiconductor device comprising:
an electrode pad,
a probe mark left on the electrode pad,
a pad metal disposed under the probe mark, the pad metal electrically connected to the electrode pad, and
a metal layer disposed under the electrode pad in an area outside of the probe mark in plan view,
wherein the pad metal and the metal layer are disposed in a same layer, and
a plurality of the electrode pads are arranged in a zigzag pattern.
12. The device of claim 11 , wherein the electrode pad and the pad metal are connected by a connector.
13. The device of claim 12 , wherein the connector is made of metal.
14. The device of claim 13 , wherein the connector is smaller than the pad metal.
15. The device of claim 14 , wherein an interlayer insulating film is disposed between the electrode pad and the metal layer.
16. The device of claim 15 , wherein the plurality of electrode pads surround an internal circuit in plan view.
17. The device of claim 16 , further comprising a bump disposed on the electrode pad.
18. The device of claim 17 , wherein the metal layer is not electrically connected to the electrode pad.
19. The device of claim 11 , wherein there is no other metal layer disposed between said metal layer and said electrode pad.