Method and apparatus for molding metal laminate film
View Patent ↗A punch ( 2 ) and a pad ( 5 ) are opposed to each other such that a molded portion ( 3 a ) of a metal laminate film ( 3 ) to be processed is interposed between the punch ( 2 ) and the pad ( 5 ). An enclosed space ( 6, 7 ) is compressed to raise only the temperature of the molded portion ( 3 a ) while keeping the vicinity of the molded portion ( 3 a ) at a low temperature (S 1 , S 2 ). After that, the enclosed space ( 6, 7 ) is moved with respect to the molded portion ( 3 a ) to perform first molding (S 3 ) on the molded portion ( 3 a ), and then gas in the enclosed space ( 6 ) is released to perform second molding (S 4 ) on the molded portion ( 3 a ) by means of the punch ( 2 ) and the pad ( 5 ).
1. A method for molding a metal laminate film, comprising the steps of:
raising a temperature of a molded portion of the metal laminate film to be processed, by moving a punch of a cope to a pad inside a die of a drag to compress gas in a first enclosed space defined by the punch, an inner surface of a plate provided around the punch and the molded portion with an area, of the metal laminate film, surrounding the molded portion interposed between the plate and the die;
first molding including primary molding on the molded portion, the primary molding including the step of moving the punch to the pad to press the gas in the first enclosed space while partially pressing the pad, which has been pressed upward close to the punch by a spring, by means of an end of a pin to move the pad against an urging force of the spring, the pin being connected to the cope at a proximal end of the pin, the primary molding being completed when the pad reaching a molding depth is stopped at a bottom dead center by an action of a cam mechanism; and
second molding performed on the molded portion by further moving the punch to the pad while releasing the gas from the first enclosed space to mold the molded portion by means of the punch, the die, and the pad.