Rack mounted liquid submersion cooled electronic system
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
1. A system, comprising:
a rack configured for receiving a plurality of electronic systems thereon, the rack having an inlet manifold and an outlet manifold;
a plurality of electronic systems mounted on the rack in a horizontal array, each electronic system comprising:
a sealed case defining a liquid tight interior space, a fluid inlet in fluid communication with the interior space and fluidly connected to the inlet manifold, a fluid outlet in fluid communication with the interior space and fluidly connected to the outlet manifold, and a plurality of heat generating electronic devices disposed within the interior space;
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices;
a heat exchanger mounted on the rack, the heat exchanger including an inlet in fluid communication with the outlet manifold and an outlet in fluid communication with the inlet manifold;
a pump fluidly connected to the heat exchanger for pumping the single-phase, dielectric cooling liquid through the heat exchanger; and
a liquid cooling system in heat exchange relationship with the heat exchanger.
2. The system of claim 1 , wherein the heat generating electronic devices comprise processors, switches, power supplies, network electronics, or data storage or memory devices.
3. The system of claim 1 , wherein the electronic systems comprise servers, routers, switch systems, telecommunication networks, power supply systems, or data storage or memory systems.
4. The system of claim 2 , further comprising a plurality of boards disposed within the interior space that are arranged parallel to and spaced from one another, and the heat generating electronic devices comprise a plurality of the data storage or memory devices mounted on each board.
5. The system of claim 2 , further comprising a plurality of boards disposed within the interior space that are arranged parallel to and spaced from one another, and the heat generating electronic devices comprise a plurality of the switches mounted on each board.
6. The system of claim 2 , wherein the heat generating electronic devices comprise a plurality of power sources.
7. The system of claim 1 , wherein the fluid inlet includes a quick connect valve, and the fluid outlet includes a quick connect valve.
8. The system of claim 1 , further comprising a manifold in the interior space of the sealed case and connected to the fluid inlet, the manifold includes a plurality of manifold outlets.
9. The system of claim 8 , further comprising a plurality of tubes, each tube having one end connected to a respective one of the manifold outlets and a second end positioned relative to an associated one of the heat generating electronic devices to direct incoming flow of single-phase dielectric cooling liquid from the fluid inlet and the manifold onto the associated heat generating electronic device.
10. A system, comprising:
a rack configured for receiving a plurality of electronic systems thereon, the rack having an inlet manifold and an outlet manifold;
a plurality of electronic systems mounted on the rack in a side-by-side horizontal array, each electronic system comprising:
a sealed case defining a liquid tight interior space, a fluid inlet in fluid communication with the interior space and fluidly connected to the inlet manifold, a fluid outlet in fluid communication with the interior space and fluidly connected to the outlet manifold, and a plurality of heat generating electronic devices disposed within the interior space;
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices;
a thermal dissipation or recovery device including an inlet in fluid communication with the outlet manifold and an outlet in fluid communication with the inlet manifold; and
a pump fluidly connected to the thermal dissipation or recovery device for pumping the single-phase, dielectric cooling liquid through the thermal dissipation or recovery device.
11. The system of claim 10 , wherein the thermal dissipation or recovery device is a heat exchanger or a heat recovery device.
12. The system of claim 10 , wherein the heat generating electronic devices comprise processors, switches, power supplies, network electronics, or data storage or memory devices.
13. The system of claim 10 , wherein the electronic systems comprise servers, routers, switch systems, telecommunication networks, power supply systems, or data storage or memory systems.
14. The system of claim 10 , wherein the rack is disposed in a first room, and the thermal dissipation or recovery device and the pump are disposed outside the first MOM.
15. The system of claim 10 , wherein the fluid inlet includes a quick connect valve, and the fluid outlet includes a quick connect valve.
16. The system of claim 10 , further comprising a manifold in the interior space of the sealed case and connected to the fluid inlet, the manifold includes a plurality of manifold outlets.
17. The system of claim 16 , further comprising a plurality of tubes, each tube having one end connected to a respective one of the manifold outlets and a second end positioned relative to an associated one of the heat generating electronic devices to direct incoming flow of single-phase dielectric cooling liquid from the fluid inlet and the manifold onto the associated heat generating electronic device.