Liquid submersion cooled electronic system
A liquid submersion cooling system that is suitable for cooling a number of electronic devices in parallel using a plurality of cases connected to a rack system. The system cools heat-generating components in server computers and other devices that use electronic, heat-generating components and are connected in parallel systems. The system includes a housing having an interior space, a dielectric cooling liquid in the interior space, a heat-generating electronic component disposed within the space and submerged in the dielectric cooling liquid. The rack system contains a manifold system to engage and allow liquid transfer for multiple cases and IO connectors to engage electrically with multiple cases/electronic devices. The rack system can be connected to a pump system for pumping the liquid into and out of the rack, to and from external heat exchangers, heat pumps, or other thermal dissipation/recovery devices.
1. An electronic device comprising:
a sealed case defining a liquid tight interior space, a liquid inlet in fluid communication with the interior space, a liquid outlet in fluid communication with the interior space, and a plurality of heat generating electronic devices within the interior space;
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices;
a manifold in the interior space of the sealed case and connected to the liquid inlet, the manifold includes a plurality of manifold outlets; and
a tube having one end connected to one of the manifold outlets and a second end closely adjacent to one of the heat generating electronic devices to direct incoming single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the one heat generating electronic device.
2. The electronic device of claim 1 , wherein the plurality of heat generating electronic devices comprise a plurality of processors, a plurality of switches, a plurality of power supplies, network electronics, or a plurality of data storage or memory devices; and
a plurality of the tubes, each tube associated with a respective one of the heat generating electronic devices, and each tube having one end connected to a respective one of the manifold outlets and a second end adjacent to its associated heat generating electronic device to direct incoming single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the associated heat generating electronic device.
3. The electronic device of claim 2 , further comprising a plurality of boards disposed within the interior space that are arranged parallel to and spaced from one another, and the heat generating electronic devices comprise a plurality of the data storage or memory devices mounted on each board.
4. The electronic device of claim 2 , further comprising a plurality of boards disposed within the interior space that are arranged parallel to and spaced from one another, and the heat generating electronic devices comprise a plurality of the switches mounted on each board.
5. The electronic device of claim 2 , wherein the heat generating electronic devices comprise a plurality of the power supplies.
6. An electronic device comprising:
a sealed case defining a liquid tight interior space, a liquid inlet in fluid communication with the interior space, a liquid outlet in fluid communication with the interior space, and a plurality of heat generating electronic devices within the interior space, the plurality of heat generating electronic devices includes a plurality of processors, a plurality of switches, a plurality of power supplies, network electronics, or a plurality of data storage or memory devices;
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices;
a manifold in the interior space of the sealed case and connected to the liquid inlet, the manifold includes a plurality of manifold outlets;
a plurality of tubes, each tube associated with a respective one of the heat generating electronic devices, and each tube having one end connected to a respective one of the manifold outlets and a second end adjacent to its associated heat generating electronic device to direct incoming single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the associated heat generating electronic device;
a plurality of plenum housings within the interior space of the sealed case, each of the plenum housings envelopes a respective one of the heat generating electronic devices and is configured to constrain single-phase dielectric cooling liquid that is introduced into the plenum housing to flow over the respective heat generating electronic device.
7. The electronic device of claim 6 , wherein each plenum housing includes an inlet port connected to the second end of a respective one of the tubes and an outlet opening that allows single-phase dielectric cooling liquid introduced into the plenum housing via the inlet port to flow out of the plenum housing and into the interior space.
8. The electronic device of claim 6 , further comprising a heat sink attached to each of the heat generating electronic devices, and each plenum housing also envelopes the heat sink of the respective heat generating electronic device.
9. An electronic device comprising:
a sealed case defining a liquid tight interior space, a liquid inlet in fluid communication with the interior space, a liquid outlet in fluid communication with the interior space, and a plurality of heat generating electronic devices within the interior space;
a single-phase, dielectric cooling liquid disposed within the interior space and submerging the heat generating electronic devices;
a manifold in the interior space of the sealed case and connected to the liquid inlet, the manifold includes a plurality of manifold outlets and is submerged in the single-phase, dielectric cooling liquid; and
a tube having one end connected to one of the manifold outlets and a second end that is positioned relative to one of the heat generating electronic devices submerged in the single-phase, dielectric cooling liquid so as to direct incoming single-phase, dielectric cooling liquid from the liquid inlet and the manifold onto the one heat generating electronic device.
10. The electronic device of claim 9 , wherein the plurality of heat generating electronic devices comprise a plurality of processors, a plurality of switches, a plurality of power supplies, network electronics, or a plurality of data storage or memory devices.
11. The electronic device of claim 9 , further comprising a plurality of the tubes, each tube associated with a respective one of the heat generating electronic devices, and each tube having one end connected to a respective one of the manifold outlets and a second end positioned relative to its associated heat generating electronic device to direct incoming flow of single-phase dielectric cooling liquid from the liquid inlet and the manifold onto the associated heat generating electronic device.
12. The electronic device of claim 11 , further comprising a plurality of plenum housings within the interior space of the sealed case, each of the plenum housings envelopes a respective one of the heat generating electronic devices and is configured to constrain single-phase dielectric cooling liquid that is introduced into the plenum housing to flow over the respective heat generating electronic device.
13. The electronic device of claim 12 , wherein each plenum housing includes an inlet port connected to the second end of a respective one of the tubes and an outlet opening that allows single-phase dielectric cooling liquid introduced into the plenum housing via the inlet port to flow out of the plenum housing and into the interior space.
14. The electronic device of claim 12 , further comprising a heat sink attached to each of the heat generating electronic devices, and each plenum housing also envelopes the heat sink of the respective heat generating electronic device.
15. The electronic device of claim 10 , further comprising a plurality of boards disposed within the interior space that are arranged parallel to and spaced from one another, and the heat generating electronic devices comprise a plurality of the data storage or memory devices mounted on each board.
16. The electronic device of claim 10 , further comprising a plurality of boards disposed within the interior space that are arranged parallel to and spaced from one another, and the heat generating electronic devices comprise a plurality of the switches mounted on each board.
17. The electronic device of claim 10 , wherein the heat generating electronic devices comprise a plurality of the power supplies.