Backplane for electrophoretic display
View Patent ↗A backplane for an electrophoretic display is provided with a plurality of layers, including a base film layer, an interconnect layer, a foil layer, and a display film layer. The foil layer includes at least one laser-formed gap, with the gap being defined in the foil layer after the foil layer has been applied to one of the other layers. In one embodiment, the interconnect layer is a printed interconnect layer. In another embodiment, the interconnect layer is a second foil layer.
1. A backplane for use in an electrophoretic display, comprising:
a base film layer;
a printed interconnect layer that is a foil material having one or more laser-formed gaps;
a foil layer comprised of an aluminum material including at least one laser-formed gap; where a region of the foil layer may be selectively heated with laser energy without vaporizing the region; and
a display film layer, wherein said at least one laser-formed gap is defined in the foil layer after the foil layer is applied to one of the other layers; and
a printed insulator layer positioned between the foil layer and the interconnect layer.
2. The backplane of claim 1 , further comprising an adhesive layer positioned adjacent to the printed interconnect layer and the foil layer.
3. The backplane of claim 2 , further comprising at least one laser-formed gap defined in the adhesive layer.
4. The backplane of claim 3 , wherein at least one of the laser-formed gaps of the foil layer is substantially aligned with at least one of the laser-formed gaps of the adhesive layer.
5. The backplane of claim 1 , further comprising a conducive adhesive positioned in at least one of the laser-formed gaps of the foil layer.
6. The backplane of claim 1 , further comprising a dielectric layer positioned adjacent to the printed interconnect layer and the foil layer.
7. The backplane of claim 6 , further comprising at least one laser-formed gap defined in the dielectric layer.
8. The backplane of claim 1 , wherein the printed insulator layer is heated through the foil layer at a temperature below an ablation threshold.
9. The backplane of claim 1 , further comprising an adhesive layer between the foil layer and the interconnect layer.
10. The backplane of claim 1 , wherein the foil layer is applied directly to the interconnect layer.