Edge-emitting etched-facet lasers
View Patent ↗A laser chip having a substrate, an epitaxial structure on the substrate, the epitaxial structure including an active region and the active region generating light, a waveguide formed in the epitaxial structure extending in a first direction, the waveguide having a front etched facet and a back etched facet that define an edge-emitting laser, and a first recessed region formed in said epitaxial structure, the first recessed region being arranged at a distance from the waveguide and having an opening adjacent to the back etched facet, the first recessed region facilitating testing of an adjacent laser chip prior to singulation of the laser chip.
1. A laser chip comprising:
a substrate;
an epitaxial structure on the substrate, the epitaxial structure including an active region, the active region generating light;
a waveguide formed in the epitaxial structure extending in a first direction, the waveguide having a front etched facet and a back etched facet that define an edge-emitting laser;
a first recessed region formed in said epitaxial structure, the first recessed region including a first end wall and two side walls and being arranged at a first distance from the waveguide and having an opening adjacent to the back etched facet, the first recessed region facilitating testing of an adjacent laser chip prior to singulation of the laser chip; and
a second recessed region formed in said epitaxial structure, the second recessed region including a second end wall and two side walls and being arranged at a second distance from the waveguide and having an opening adjacent to the front etched facet;
wherein the opening to the first recessed region and the opening to the second recessed region are aligned to each other.
2. The laser chip of claim 1 , wherein the first end wall is at an angle other than normal to the first direction.
3. The laser chip of claim 2 , wherein the back etched facet is coated with a highly reflective material.
4. The laser chip of claim 1 , wherein the second end wall is at angle other than normal to the first direction.
5. The laser chip of claim 1 , wherein the edge-emitting laser is a ridge laser.
6. The laser chip of claim 5 , wherein the ridge laser is of a Fabry-Perot (FP) type.
7. The laser chip of claim 5 , wherein the ridge laser is of a distributed feedback (DFB) type.
8. The laser chip of claim 1 , wherein the edge-emitting laser is a Buried Heterostructure (BH) laser.
9. The laser chip of claim 8 , wherein the BH laser is of a Fabry-Perot (FP) type.
10. The laser chip of claim 8 , wherein the BH laser is of a distributed feedback (DFB) type.
11. The laser chip of claim 1 , wherein the substrate is InP.
12. The laser chip of claim 1 , wherein the substrate is GaAs.
13. The laser chip of claim 1 , wherein the substrate is GaN.
14. A laser chip comprising:
a substrate;
an epitaxial structure on the substrate, the epitaxial structure including an active region, the active region generating light;
a first waveguide formed in the epitaxial structure extending in a first direction, the first waveguide having a first front etched facet and a first back etched facet that define a first edge-emitting laser;
a second waveguide formed in the epitaxial structure extending in the first direction, the second waveguide having a second front etched facet and a second back etched facet that define a second edge-emitting laser;
a first recessed region formed in said epitaxial structure, the first recessed region including a first end wall and two side walls and being arranged at a first distance from the waveguide and having an opening adjacent to one of the first back etched facet and the second back etched facet, the first recessed region facilitating testing of an adjacent laser chip prior to singulation of the laser chip; and
a second recessed region formed in said epitaxial structure, the second recessed region including a second end wall and two side walls and being arranged at a second distance from the waveguide and having an opening adjacent to one of the first back etched facet and the second back etched facet;
wherein the opening to the first recessed region and the opening to the second recessed region are aligned to each other.
15. The chip of claim 14 , wherein at least one of the first and second edge-emitting lasers is a ridge distributed feedback (DFB) laser.
16. The laser of claim 14 , wherein at least one of the first and second edge-emitting lasers is a Buried Heterostructure (BH) distributed feedback (DFB) laser.