HEATER ASSEMBLY FOR DISK PROCESSING SYSTEM
A heater assembly for a disk processing system including a heater element configured to heat a substrate carried by a holder, and a heater cover having an aperture to expose the heater element to the substrate. The cover may be metal to thermally couple the heater to a cooling plate. The cover may have an outer surface having a thermal barrier surrounding the aperture to thermally insulate the holder.
1 . A heater assembly for a disk processing system, comprising:
a heater element configured to heat a substrate carried by a holder; and
a heater cover having an aperture to expose the heater element to the substrate, wherein the heater cover further comprises an outer surface having a thermal barrier surrounding the aperture to thermally insulate the holder.
2 . The heater assembly of claim 1 wherein the thermal barrier comprises zirconia oxide.
3 . The heater assembly of claim 1 further comprising a cooling plate, wherein the heater cover thermally couples the heater element to the cooling plate.
4 . The heater assembly of claim 3 wherein the heater cover comprises a metal that provides the thermal coupling between the heater element and the cooling plate.
5 . The heater assembly of claim 4 wherein the metal comprises copper.
6 . The heater assembly of claim 5 wherein the copper comprises oxygen free copper.
7 . A heater assembly for a disk processing system, comprising:
a heater element configured to heat a substrate carried by a holder;
a cooling plate; and
a heater cover having an aperture to expose the heater element to the substrate, wherein the heater cover comprises a metal to thermally couple the heater element to the cooling plate.
8 . The heater assembly of claim 7 wherein the metal comprises copper.
9 . The heater assembly of claim 8 wherein the copper comprises oxygen free copper.
10 . The heater assembly of claim 7 wherein the heater cover comprises an outer surface having a zirconia oxide thermal barrier surrounding the aperture to thermally insulate the holder.
11 . A method of heating a substrate carried by a holder in a disk processing system, comprising:
heating the substrate with a heater element that radiates through an aperture in a heater cover; and
thermally insulating the holder while heating the substrate via a thermal barrier on an outer surface of the heater cover surrounding the aperture.
12 . The method of claim 11 wherein the thermal barrier comprises zirconia oxide.
13 . The method of claim 11 further comprising thermally coupling the heater element to a cooling plate via the heater cover.
14 . The method of claim 13 wherein the heater cover comprises a metal that thermally couples the heater element to the cooling plate.
15 . The method of claim 14 wherein the metal comprises copper.
16 . The method of claim 15 wherein the copper comprises oxygen free copper.
17 . A method of heating a substrate carried by a holder in a disk processing system, comprising:
heating the substrate with a heater element that radiates through an aperture in a metal heater cover; and
thermally coupling the heater element to a cooling plate via a metal heater cover.
18 . The method of claim 17 wherein the metal comprises copper.
19 . The method of claim 18 wherein the copper comprises oxygen free copper.
20 . The method of claim 17 further comprising thermally insulating the holder while heating the substrate via a zirconia oxide thermal barrier on an outer surface of the heater cover surrounding the aperture.