Solid state power source with frames for attachment to an electronic circuit
View Patent ↗A power source for a solid state device includes: a first frame having a first contact portion, a first bonding portion and a first extension portion between the first contact portion and the first bonding portion; a second frame having a second contact portion, a second bonding portion and a second extension portion between the second contact portion and the second bonding portion; and a first pole layer, an electrolyte layer and a second pole layer positioned between the first and second contact portions, wherein a first portion of the electrolyte layer is positioned between the first extension and the first pole and a second portion of the electrolyte layer is positioned between the first extension and the second pole.
1. A device, comprising:
an electronic circuit having a substrate with a first side and a second side;
a first frame and a second frame;
a first side encapsulant region and a second side encapsulant region positioned between the first and second frames;
a first battery having a first pole layer, a first electrolyte layer and a second pole layer positioned between the first and second frames, and between the first and second side encapsulant regions,
wherein the first and second frames electrically and mechanically contact the electronic circuit on the first side of the substrate.
2. The device according to claim 1 , wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer, and the first and second side encapsulant regions include the first polymer.
3. The device according to claim 2 , further comprising third and fourth side encapsulant regions positioned between the first and second contact portions such that the first, second, third and fourth encapsulant regions encircle the first and second poles.
4. The device according to claim 1 , wherein the first electrolyte layer is a composite including an electrolyte salt and a first polymer and the first and second side encapsulant regions include a second polymer different than the first polymer.
5. The device according to claim 4 , further comprising third and fourth side encapsulant regions positioned between the first and second frames such that the first, second, third and fourth encapsulant regions encircle the first and second poles.
6. The device according to claim 1 , wherein the first frame is attached to the first pole layer with a first conductive adhesive layer and the second frame is attached to the second pole layer with a second conductive adhesive layer.
7. The device according to claim 1 , further comprising;
a hermetic enclosure surrounding the first battery and substrate.
8. The device according to claim 1 , further comprising:
a first conductive connection adhesive electrically and mechanically connecting the first frame to the electronic circuit on the first side of the substrate and a second conductive connection adhesive electrically and mechanically connecting the second frame to the electronic circuit on the first side of the substrate.
9. The device according to claim 1 , further comprising
a second battery having a third pole layer, a second electrolyte layer and a fourth pole layer positioned between third and fourth frames, and between third and fourth side encapsulant regions.
10. The device according to claim 9 , further comprising:
a third conductive connection adhesive electrically and mechanically connecting the third frame to the electronic circuit on the second side of the substrate and a fourth conductive connection adhesive electrically and mechanically connecting the fourth frame to the electronic circuit on the second side of the substrate.