Enhancing planarization uniformity in optical devices
View Patent ↗An optical device is formed from a device precursor having a layer of a light-transmitting medium on a base. A first feature is formed on the device precursor. The device precursor is then processed such that a stop layer protects the first feature and a portion of the device precursor is above the top of the stop layer. The first feature is between the base and the stop layer. The device precursor is planarized such that the portion of the device precursor located above the top of the stop layer becomes flush with the top of the portion of the stop layer that is present on the device precursor after the planarization. During the planarization, the stop layer acts as a planarization stop that slows or stops the rate of planarization.
1. A method of forming an optical device, comprising:
generating a device precursor having a layer of a light-transmitting medium on a base, the device precursor being a precursor for the optical device;
forming a first feature on the device precursor, the feature including a recess in the device precursor;
processing the device precursor such that a stop layer protects the first feature and a portion of the device precursor is above a top of the stop layer,
the stop layer protecting the first feature such that the recess is between the base and the stop layer; and
planarizing the device precursor such that the portion of the device precursor located above a top of the stop layer becomes flush with the top of the stop layer,
the stop layer acting as a planarization stop while planarizing the device precursor, wherein the stop layer extends across an opening of the recess.
2. The method of claim 1 , wherein the portion of the device precursor located above a top of the stop layer includes an active medium and a ratio of a rate at which the planarization consumes the active medium: a rate at which the planarization consumes the stop layer is greater than 100:1.
3. The method of claim 1 , wherein the portion of the device precursor located above a top of the stop layer includes an active medium and a ratio of a rate at which the planarization consumes the active medium: a rate at which the planarization consumes the stop layer is greater than 100:1.
4. The method of claim 1 , wherein the recess extends into the light-transmitting medium.
5. The method of claim 1 , wherein forming a ridge of an optical waveguide on the device precursor includes forming the recess.
6. The method of claim 1 , wherein the first feature is one of a plurality of first features that are protected by the stop layer.
7. The method of claim 1 , wherein processing the device precursor includes forming the stop layer on the device precursor; and
forming a second feature on the device precursor after forming the stop layer.
8. The method of claim 7 , wherein the second feature is one of a plurality of second features formed on the device precursor after forming the stop layer and before performing the planarization.
9. The method of claim 7 , wherein forming the second feature on the device includes forming a second recess on the device precursor such that the second recess extends into the light-transmitting medium and the portion of the device precursor located above the top of the stop layer includes a medium that extends through the stop layer and into an interior of the second recess.
10. The method of claim 9 , further comprising:
generating an active component on the device precursor, the medium serving as an active medium in the active component.
11. The method of claim 10 , wherein generating the active component includes generating an optical waveguide configured to guide a light signal through the active medium, the waveguide being defined by a ridge of the active medium.
12. The method of claim 10 , wherein the active component is one or more components selected from a group consisting of an optical modulator and a light sensor.
13. The method of claim 7 , wherein forming the second feature on the device precursor includes forming a mask on the device, the mask being included in the portion of the device precursor located above a top of the stop layer.
14. The method of claim 1 , wherein the planarization consumes a portion of the stop layer and the stop layer is present on the device precursor after termination of the planarization.
15. The method of claim 14 , further comprising:
removing the stop layer after planarizing the device precursor.
16. The method of claim 1 , wherein the recess is between the base and the stop layer such that an imaginary line can be drawn perpendicular to the base while also extending through both the recess and the stop layer.
17. The method of claim 1 , wherein the recess is between the base and the stop layer such that an imaginary line perpendicular to the base can extend through a side of the recess and into direct physical contact with the stop layer.
18. The method of claim 1 , wherein the stop layer is positioned in an interior of the recess.
19. The method of claim 1 , wherein the stop layer is positioned over the recess in a direction perpendicular from the base.