IP Library Granted Patent US 8,772,821
Granted Patent B2
US 8,772,821 · App. 13/696,744 · Granted Jul 8, 2014

Optoelectronic semiconductor part containing alkali-free and halogen-free metal phosphate

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Quick Facts
Patent No.
US 8,772,821
App. No.
13/696,744
Granted
Jul 8, 2014
Kind
B2
Abstract

An optoelectronic semiconductor part comprising a light source, a housing and electrical connections, wherein the optoelectronic semiconductor part comprises a component which contains metal phosphate, and wherein the metal phosphate is substantially alkali-free and halogen-free.

Claims (10)

1. An optoelectronic semiconductor part comprising a light source, a housing and electrical connections, wherein the optoelectronic semiconductor part comprises a component which contains metal phosphate, and wherein the metal phosphate contains no more than 1 mol-% of alkali oxides and halogen-containing components.

2. The optoelectronic semiconductor part as claimed in claim 1 , wherein the metal phosphate contains phosphate as the main component.

3. The optoelectronic semiconductor part as claimed in claim 1 , wherein the metal phosphate contains in the range of 5mol-% to 75mol-% of P2O5 and, in particular in the range of 5 mol-% to 25 mol-% Al2O3or Y2O3.

4. The optoelectronic semiconductor part as claimed in claim 1 , wherein in the range of 0.5 mol-% to 10 mol-% of vanadium V, tellurium Te and/or bismuth Bi is added to the metal phosphate in each case.

5. The optoelectronic semiconductor part as claimed in claim 1 , wherein inorganic components which increase the refractive index and/or serve as fillers and/or act as optical filters and/or reflect and/or reduce reflection and/or absorb radiation are added to the metal phosphate.

6. The optoelectronic semiconductor part as claimed in claim 1 , wherein the component which contains metal phosphate is an adhesive as a binding agent between two components of the semiconductor part.

7. The optoelectronic semiconductor part as claimed in claim 1 , wherein the component which contains metal phosphate is a matrix for a conversion element.

8. The optoelectronic semiconductor part as claimed in claim 1 , wherein the component which contains metal phosphate is a housing component or a lens.

9. The optoelectronic semiconductor part as claimed in claim 1 , wherein the component which contains metal phosphate is a protective layer for luminophore particles.

10. The optoelectronic semiconductor part as claimed in claim 1 , wherein the component which contains metal phosphate is a coating or a matrix of a coating of the conversion element.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 11, 2013
From: EBERHARDT, ANGELA; WILLE, CHRISTINA; WIRTH-SCHOEN, JOACHIM
To: OSRAM AG
Reel/Frame 029611/0323 →
CHANGE OF NAME Recorded Jan 11, 2013
From: OSRAM AG
To: OSRAM GMBH
Reel/Frame 029611/0574 →