Radiation-emitting semiconductor body, method for producing a radiation-emitting semiconductor body and radiation-emitting semiconductor component
View Patent ↗A radiation-emitting semiconductor body is provided which, besides an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation, has a carrier layer that is intended to mechanically stabilize the epitaxial semiconductor layer sequence. The semiconductor body furthermore has contact structures for electrical contacting of the semiconductor body, which respectively have a volume region and a surface bonding region. The surface bonding region is formed from a material which is different from the material of the volume region.
1. A radiation-emitting semiconductor body, comprising:
an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation;
a carrier layer configured to mechanically stabilize the epitaxial semiconductor layer sequence, wherein the carrier layer comprises a metallic material; and
contact structures for electrical contacting of the semiconductor body, each contact structure having a volume region and a surface bonding region, the surface bonding region being formed from a material that is different from the material of the volume region.
2. The radiation-emitting semiconductor body according to claim 1 , wherein the volume region is formed from the same material as the carrier layer.
3. The radiation-emitting semiconductor body according to claim 1 , wherein the metallic material is selected from the group consisting of nickel, molybdenum and copper.
4. The radiation-emitting semiconductor body according to claim 1 , wherein the surface bonding regions comprise at least one material selected from the group consisting of gold, copper and aluminum.
5. The radiation-emitting semiconductor body according to claim 1 , wherein the contact structures are formed by projections, which respectively have a width of between 20 μm and 200 μm and a height of between 5 μm and 50 μm, the limits being included.
6. The radiation-emitting semiconductor body according to claim 1 , wherein the contact structures are formed by projections, which respectively have a width of between 20 μm and 200 μm, the limits being included.
7. The radiation-emitting semiconductor body according to claim 1 , wherein the contact structures are formed by projections, which respectively have a height of between 5 μm and 50 μm, the limits being included.
8. The radiation-emitting semiconductor body according to claim 1 , wherein each contact structures is formed by a projection, the respective surface bonding regions extending beyond the volume regions on both sides.
9. The radiation-emitting semiconductor body according to claim 1 , wherein the surface bonding regions are formed so as to be ultrasound-friction weldable and/or thermocompressible.
10. A method for producing a radiation-emitting semiconductor body, the method comprising:
providing an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation;
applying a carrier layer onto a main side of the epitaxial semiconductor layer sequence, the carrier layer being configured to mechanically stabilize the epitaxial semiconductor layer sequence, wherein the material of the carrier layer is metallic material;
applying a bondable layer; and
forming contact structures by photolithography on the carrier layer, the contact structures respectively having a volume region and a surface bonding region.
11. The method according to claim 10 , further comprising applying a further layer of the same material as the carrier layer between the carrier layer and the bondable layer.
12. The method according to claim 11 , wherein the volume regions of the contact structures are formed from the material of the further layer.
13. The method according to claim 10 , wherein the volume regions of the contact structures are formed from the material of the carrier layer.
14. The method according to claim 13 , wherein the bondable layer is applied in direct contact onto the carrier layer.
15. The method according claim 10 , wherein the surface bonding region and/or the bondable layer is/are formed so as to be ultrasound-friction weldable and/or thermocompressible.
16. A radiation-emitting semiconductor component comprising a chip carrier and a radiation-emitting semiconductor body according to claim 1 that is applied onto the chip carrier.
17. The radiation-emitting semiconductor component according to claim 16 , wherein the semiconductor body is applied onto the chip carrier by ultrasound-friction welding or thermocompression.