IP Library Patent Application 13698854
Patent Application
App. No. 13/698,854

METHOD OF FABRICATING MICRO STRUCTURED SURFACES WITH ELECTRICALLY CONDUCTIVE PATTERNS

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Quick Facts
Patent No.
US None
App. No.
13/698,854
Abstract

A method comprises forming a first pattern on a first flat surface and forming an inverse of the pattern on a second flat surface. The method further comprises attaching the second flat surface to a roller to produce an embossing tool and applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate. The substrate is coated with a radiation curable resin material. The method also comprises transferring ink to the substrate, the ink containing a catalyst, and coating the substrate with the second pattern in an electroless plating bath. The first pattern alternatively may be formed on a sleeve which is then attached to a drum/roller.

Claims (35)

1 . A method, comprising:

forming a first pattern on a first flat surface;

forming an inverse of the pattern on a second flat surface;

attaching the second flat surface to a ropier to produce an embossing tool;

applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate, wherein the substrate is coated with a radiation curable resin material; and

coating the substrate with the second pattern in an electroless plating bath.

2 . The method of claim 1 wherein the radiation curable resin material does not include an organometallic compound and the method further comprises transferring a catalyst-based ink onto the substrate before coating the substrate in the electroless plating bath.

3 . The method of claim 1 further comprising transferring a catalyst-based ink onto the substrate before coating the substrate in the electroless plating bath.

4 . The method of claim 1 , wherein the radiation curable resin material comprises an organometallic compound.

5 . The method of claim 1 further comprising curing the substrate with the second pattern to produce a cured structure on the substrate,

6 . The method of claim 5 wherein coating the substrate comprises coating the cured structure on the substrate.

7 . The method of claim 1 further comprising applying pressure between the embossing tool and the substrate.

8 . A method, comprising:

forming a first pattern on a first flat surface;

forming an inverse of the pattern on a second flat surface;

attaching the second flat surface to a roller to produce an embossing tool;

applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate, wherein the substrate is coated with a radiation curable resin material;

transferring ink to at least a portion of the substrate, said ink containing a catalyst; and

coating the substrate with the second pattern in an electroless plating bath.

9 . The method of claim 8 wherein the radiation curable resin material does not include an organometallic compound.

10 . The method of claim 8 further comprising curing the substrate.

11 . A method, comprising:

creating a photomask;

applying the photomask to a flexographic plate;

exposing the photomask and flexographic plate to radiation to produce a printing plate based on said flexographic plate; and

transferring a catalyst-based ink to the printing plate.

12 . The method of claim 11 further comprising transferring ink from the printing plate to a film.

13 . The method of claim 12 further comprising curing said film.

14 . The method of claim 13 further comprising coating the film in an electroless plating bath.

15 . The method of claim 11 wherein applying the photomask to the flexographic plate comprises laminating the photomask to the flexographic plate.

16 . A method, comprising forming a first pattern on a sleeve;

mounting said sleeve around a drum thereby forming an embossing tool;

applying pressure between the embossing tool and a substrate thereby forming a second pattern in the substrate, wherein the substrate is coated with a radiation curable resin material; and

coating the substrate with the second pattern in an electroless plating bath.

17 . The method of claim 16 wherein mounting said sleeve around said drum comprising creating a temperature differential between said sleeve and drum.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2016
From: UNIPIXEL DISPLAYS, INC.
To: EASTMAN KODAK COMPANY
Reel/Frame 037615/0679 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
From: HUDSON BAY FUND, LP
To: UNI-PIXEL, INC.; UNI-PIXEL DISPLAYS, INC.
Reel/Frame 037445/0150 →