PLASMA PROCESSING APPARATUS
A plasma processing apparatus 1 includes a stock unit 2 , a processing chamber 5 , and an alignment chamber 4 . The stock unit 2 supplies and collects a conveyable tray 7 and accommodates a wafer W in each of the plurality of accommodation holes 7 a penetrating through in the thickness direction. In the processing chamber 5 , plasma processing is performed to the wafers W accommodated in the tray 7 supplied from the stock unit 2 . The alignment chamber 4 includes a rotary table 41 on which the tray 7 before being subjected to plasma processing is placed, and positioning of the wafer W on the rotary table 41 is carried out. A wafer presence-absence determining unit 6 a of the control apparatus 6 determines whether the wafer W is present in each of the accommodation holes 7 a of the tray 7 placed on the rotary table 41 of the alignment chamber 4 , based on a signal from the wafer presence-absence detecting sensors 44 A and 44 B.
1 . A plasma processing apparatus, comprising:
a stock unit for supplying and collecting a conveyable tray that accommodates a wafer in each of a plurality of accommodation holes penetrating through in a thickness direction;
a processing unit that performs plasma processing to each wafer accommodated in the tray supplied from the stock unit;
an alignment unit that has a table on which the tray before being subjected to the plasma processing is placed, positioning of the wafer on the table being performed at the alignment unit; and
a wafer presence-absence detecting unit that detects whether or not the wafer is present in each of the accommodation holes of the tray placed on the table of the alignment unit.
2 . The plasma processing apparatus according to claim 1 , further comprising:
a conveying mechanism that conveys the tray; and
a conveyance control unit that causes the tray on the table to be returned to the stock unit instead of the tray being conveyed to the processing unit by the conveying mechanism, when the wafer presence-absence detecting unit detects that the wafer is not accommodated in any of the accommodation holes of the tray placed on the table.
3 . The plasma processing apparatus according to claim 2 , wherein the wafer presence-absence detecting unit includes:
an optical sensor for detecting the wafer accommodated in each of the accommodation holes of the tray on the table; and
a determining unit that determines whether or not the wafer is present in each of the accommodation holes provided to the tray, based on a signal from the optical sensor.
4 . The plasma processing apparatus according to claim 3 , wherein the optical sensor includes:
a light projector that projects inspection light toward the tray; and
a light receiver that is arranged at a position where the inspection light is blocked and unreceived when the wafer is accommodated in any of the accommodation holes of the tray, and where the inspection light is received when the wafer is not accommodated in any of the accommodation holes of the tray.
5 . The plasma processing apparatus according to claim 1 , wherein the wafer presence-absence detecting unit includes:
an imaging unit that images the accommodation holes of the tray on the table from above; and
a determining unit that determines whether or not the wafer is present in each of the accommodation holes of the tray, based on an image obtained by the imaging unit.
6 . The plasma processing apparatus according to claim 1 , wherein the table is a rotary table that rotates the tray within a horizontal plane, and
wherein the wafer presence-absence detecting unit detects whether or not the wafer is present in each of the accommodation holes provided to the tray, while the tray is rotated by the rotary table.
7 . The plasma processing apparatus according to claim 6 , wherein the alignment unit includes:
a centering mechanism that performs center position alignment of the tray relative to the rotary table; and
a rotary direction positioning unit that performs positioning in a rotation direction of the tray while the tray is rotated by the rotary table, and
wherein the wafer presence-absence detecting unit detects whether or not the wafer is present in each of the accommodation holes provided to the tray, while the positioning in the rotation direction is performed by the rotary direction positioning unit.
8 . The plasma processing apparatus according to claim 1 , further comprising:
an alarm issuing unit that issues an alarm when the wafer presence-absence detecting unit detects that the wafer is not accommodated in any of the accommodation holes of the tray.
9 . A plasma processing method, comprising:
conveying from a stock unit to an alignment unit a tray that accommodates a wafer in each of a plurality of accommodation holes penetrating through in a thickness direction, and placing the tray on a table;
detecting whether or not the wafer is present in each of the accommodation holes of the tray on the table of the alignment unit;
conveying the tray from the alignment unit to the processing unit when the wafer is present in each of the accommodation holes of the tray on the table, and executing plasma processing; and
returning the tray from the alignment unit to the stock unit when the wafer is absent in any of the accommodation holes of the tray on the table.