IP Library Granted Patent US 8,803,161
Granted Patent B2
US 8,803,161 · App. 13/700,331 · Granted Aug 12, 2014

Semiconductor device and solid state relay using same

Inventors: Hiroshi Okada (Mie, JP); Takuya Sunada (Osaka, JP); Takeshi Oomori (Osaka, JP)
Assignee: Panasonic Corporation
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Quick Facts
Patent No.
US 8,803,161
App. No.
13/700,331
Granted
Aug 12, 2014
Kind
B2
Abstract

A semiconductor device includes one or more unipolar compound semiconductor element; and bypass semiconductor elements externally connected to the respective compound semiconductor elements in parallel. A turn-on voltage of the bypass semiconductor elements is smaller than a turn-on voltage of the compound semiconductor elements in the direction from the source to the drain.

Claims (18)

1. A semiconductor device comprising:

one or more unipolar compound semiconductor elements; and

one or more bypass semiconductor elements externally connected to the respective compound semiconductor elements in parallel,

wherein a turn-on voltage of the bypass semiconductor elements is smaller than a turn-on voltage of the compound semiconductor elements in a direction from a source to a drain.

2. The semiconductor device of claim 1 , wherein each of the bypass semiconductor elements is formed of a silicon diode, and

a drain and a source of each of the compound semiconductor elements are respectively connected to a cathode and an anode of the corresponding silicon diode.

3. The semiconductor device of claim 1 , wherein each of the bypass semiconductor elements is formed of a Si-MOSFET, and

a drain and a source of each of the compound semiconductor elements are respectively connected to a cathode and an anode of the corresponding Si-MOSFET.

4. The semiconductor device of claim 1 , wherein each of the bypass semiconductor elements is formed of a SiC-Schottky diode, and

a drain and a source of each of the compound semiconductor elements are respectively connected to a cathode and an anode of the corresponding SiC-Schottky diode.

5. The semiconductor device of claim 1 , wherein each of the compound semiconductor elements is formed of a SiC-FET or a GaN-FET.

6. The semiconductor device of claim 1 , wherein the compound semiconductor elements are connected in anti-series with their sources in common.

7. A solid state relay comprising:

the semiconductor device of claim 1 ;

a light emitting element configured to emit lights in response to an input signal;

a photodiode array which receives the lights and generates a power; and

a charge and discharge circuit connected to the photoelectric array in parallel,

wherein gates and sources of the compound semiconductor elements included in the semiconductor device are connected to opposite ends of the photodiode array, respectively.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2013
From: OKADA, HIROSHI; SUNADA, TAKUYA; OOMORI, TAKESHI
To: PANASONIC CORPORATION
Reel/Frame 029871/0704 →
Priority Claims (1)
JP 2010-128095 · Jun 3, 2010 · national
Continuity (1)
Related Publication 20130069082A1 · Mar 21, 2013