IP Library Granted Patent US 8,861,764
Granted Patent B2
US 8,861,764 · App. 13/700,943 · Granted Oct 14, 2014

Microphone unit and sound input device incorporating same

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Quick Facts
Patent No.
US 8,861,764
App. No.
13/700,943
Granted
Oct 14, 2014
Kind
B2
Abstract

An enclosure ( 10 ) of a microphone unit ( 1 ) includes a mounting portion ( 11 ) which has a mounting surface ( 11 a ) where a first vibration portion ( 13 ) and a second vibration portion ( 15 ) are mounted and in which, in the back surface ( 11 b ) of the mounting surface ( 11 a ), a first sound hole ( 23 ) and a second sound hole ( 25 ) are provided; in the enclosure ( 10 ), a first sound path ( 41 ) is provided that transmits sound waves input through the first sound hole ( 23 ) to one surface of a first diaphragm ( 134 ) and that also transmits the sound waves to one surface of a second diaphragm ( 154 ) and a second sound path ( 42 ) is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm ( 154 ).

Claims (28)

1. A microphone unit comprising:

a mounting portion in which a first diaphragm, a second diaphragm and an electrical circuit portion are mounted on a same mounting surface; and

a lid portion which covers the first diaphragm, the second diaphragm and the electrical circuit portion,

wherein the first diaphragm and the second diaphragm are arranged substantially parallel to the mounting surface,

in a back surface of the mounting surface of the mounting portion, a first sound hole and a second sound hole are provided, and

an enclosure formed with the mounting portion and the lid portion includes:

a first sound path that transmits sound waves input through the first sound hole to one surface of the first diaphragm and also transmits the sound waves to one surface of the second diaphragm;

a second sound path that transmits sound waves input through the second sound hole to the other surface of the second diaphragm; and

an airtight space facing the other surface of the first diaphragm.

2. The microphone unit of claim 1 , wherein:

the lid portion forms, together with the mounting portion, a first holding space holding the first diaphragm and a second holding space holding the second diaphragm,

in the mounting surface, a first opening portion that is covered by the first diaphragm and a second opening portion that is covered by the second diaphragm are provided,

the first sound path is formed with the first sound hole, the first opening portion, the second opening portion and a hollow space that is formed within the mounting portion and that makes the first sound hole communicate with the first opening portion and the second opening portion,

the second sound path is formed with the second sound hole and the second holding space, and

the first holding space is the airtight space.

3. The microphone unit of claim 1 , wherein:

the lid portion forms, together with the mounting portion, a holding space holding the first diaphragm and the second diaphragm;

in the mounting surface, an opening portion that is covered by the second diaphragm is provided;

the first sound path is formed with the first sound hole and the holding space; and

the second sound path is formed with the second sound hole, the opening portion and a hollow space that is formed within the mounting portion and that makes the second sound hole communicate with the opening portion.

4. The microphone unit of claim 1 , wherein the electrical circuit portion comprises:

a first electrical circuit portion that processes the electrical signal obtained in the first diaphragm; and

a second electrical circuit portion that processes the electrical signal obtained in the second diaphragm.

5. The microphone unit of claim 1 , further comprising:

an electrode formed on the mounting surface for electrical connection to the electrical circuit portion; and

an electrode pad formed on a back surface of the mounting portion and electrically connected to the electrode.

6. The microphone unit of claim 1 , further comprising a sealing portion formed on the back surface of the mounting surface of the mounting portion so as to produce airtightness when the sealing portion is mounted on a mounting substrate to surround perimeters of the first sound hole and the second sound hole.

7. A sound input device comprising the microphone unit of claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2025
From: FUNAI GROUP CO., LTD
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 073121/0824 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2025
From: FUNAI ELECTRIC CO., LTD. (F/K/A FE-TECH CO., LTD.)
To: FEC IP LLC
Reel/Frame 073121/0883 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 3, 2012
From: TANAKA, FUMINORI; INODA, TAKESHI; HORIBE, RYUSUKE
To: FUNAI ELECTRIC CO., LTD.
Reel/Frame 029391/0130 →