Interface treatment method for germanium-based device
Disclosed herein is an interface treatment method for germanium-based device, which belongs to the field of manufacturing technologies of ultra large scaled integrated (ULSI) circuits. In the method, the natural oxide layer on the surface of the germanium-based substrate is removed by using a concentrated hydrochloric acid solution having a mass percentage concentration of 15%˜36%, and dangling bonds of the surface are performed a passivation treatment by using a diluted hydrochloric acid solution having a mass percentage concentration of 5%˜10% so as to form a stable passivation layer on the surface. This method makes a good foundation for depositing a high-K (high dielectric constant) gate dielectric on the surface of the germanium-based substrate after cleaning and passivating, enhances quality of the interface between the gate dielectric and the substrate, and improves the electrical performance of germanium-based MOS device.
1. An interface treatment method for a germanium-based device, comprising:
1) cleaning a germanium-based substrate;
2) removing a natural oxide layer on a surface of the germanium-based substrate by using a concentrated hydrochloric acid solution having a mass percentage concentration of 15%-36%; and
3) performing a passivation treatment for the surface of the germanium-based substrate by using a diluted hydrochloric acid solution having a mass percentage concentration of 5%-10%.
2. The method according to claim 1 , wherein, the germanium-based substrate is a bulk germanium substrate, an epitaxial germanium substrate, or a germanium-on-insulator substrate.
3. The method according to claim 1 , wherein, in step 1), the germanium-based substrate is firstly cleaned by an organic solvent, and is then boiled in a hydrochloric acid to be cleaned.
4. The method according to claim 1 , wherein, in step 2), the germanium-based substrate is soaked in the concentrated hydrochloric acid solution for 10-30 seconds and then is moved into deionized water to be rinsed circularly for 15-20 times, and then the surface of the germanium-based substrate is dried.
5. The method according to claim 1 , wherein, in step 3), the germanium-based substrate is soaked in the diluted hydrochloric acid solution for 5 minutes-30 minutes and then is moved into deionized water to be rinsed circularly for 10-15 times, and then the surface of the germanium-based substrate is dried.