Ultraviolet semiconductor light-emitting element that emits ultraviolet light from one surface side
View Patent ↗An ultraviolet semiconductor light-emitting element comprises a light-emitting layer which is arranged between an n-type nitride semiconductor layer and a p-type nitride semiconductor layer, an n-electrode that is in contact with the n-type nitride semiconductor layer, and a p-electrode that is in contact with the p-type nitride semiconductor layer. The p-type nitride semiconductor layer is provided with a p-type contact layer that has a band gap smaller than that of the light-emitting layer and is in ohmic contact with the p-electrode. A depressed part is formed in a reverse side surface of a surface of the p-type nitride semiconductor layer that faces the light-emitting layer so as to avoid a formation region on which the p-electrode is formed. A reflective film that reflects ultraviolet light emitted from the light-emitting layer is formed on an inner bottom surface of the depressed part.
1. An ultraviolet semiconductor light-emitting element, comprising:
a light-emitting layer which is arranged between an n-type nitride semiconductor layer and a p-type nitride semiconductor layer;
an n-electrode that is in contact with the n-type nitride semiconductor layer; and
a p-electrode that is in contact with the p-type nitride semiconductor layer,
wherein a depressed part is formed in a reverse side surface of a surface of the p-type nitride semiconductor layer facing the light-emitting layer so as to avoid an region on which the p-electrode is formed,
a reflective film that reflects ultraviolet light emitted from the light-emitting layer is formed on an inner bottom surface of the depressed part,
in the ultraviolet semiconductor light-emitting element, the ultraviolet light emitted from the light-emitting layer is taken out from an opposite side of the n-type nitride semiconductor layer from the light-emitting layer, and
a depth of the depressed part is less than a thickness of the p-type nitride semiconductor layer.
2. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the depressed part formed in the p-type nitride semiconductor layer comprises a plurality of depressed parts.
3. The ultraviolet semiconductor light-emitting element according to claim 2 , wherein the p-type nitride semiconductor layer comprises at least a p-type contact layer that has a band gap smaller than that of the light-emitting layer and is in ohmic contact with the p-electrode.
4. The ultraviolet semiconductor light-emitting element according to claim 3 , wherein the p-type nitride semiconductor layer includes the p-type contact layer and a p-type clad layer having a band gap larger than that of the p-type contact layer in this order from the p-electrode side.
5. The ultraviolet semiconductor light-emitting element according to claim 4 ,
wherein the depth of the depressed part is more than a thickness of the p-type contact layer, and
the depth of the depressed part is less than a sum of the thickness of the p-type contact layer and a thickness of the p-type clad layer.
6. The ultraviolet semiconductor light-emitting element according to claim 3 ,
wherein the depth of the depressed part is at most equal to a thickness of the p-type contact layer.
7. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the p-type nitride semiconductor layer comprises at least a p-type contact layer that has a band gap smaller than that of the light-emitting layer and is in ohmic contact with the p-electrode.
8. The ultraviolet semiconductor light-emitting element according to claim 7 , wherein the p-type nitride semiconductor layer includes the p-type contact layer and a p-type clad layer having a band gap larger than that of the p-type contact layer in this order from the p-electrode side.
9. The ultraviolet semiconductor light-emitting element according to claim 8 ,
wherein the depth of the depressed part is more than a thickness of the p-type contact layer, and
the depth of the depressed part is less than a sum of the thickness of the p-type contact layer and a thickness of the p-type clad layer.
10. The ultraviolet semiconductor light-emitting element according to claim 7 ,
wherein the depth of the depressed part is at most equal to a thickness of the p-type contact layer.
11. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the reflective film is extended to above the p-electrode.
12. The ultraviolet semiconductor light-emitting element according to claim 1 ,
wherein the p-type nitride semiconductor layer has a surface facing the light-emitting layer, and
a distance from the surface of the p-type nitride semiconductor layer facing the light-emitting layer to the inner bottom surface of the depressed part is at most equal to 10 nm.
13. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the reflective film is smaller in planar size than the inner bottom surface of the depressed part.
14. The ultraviolet semiconductor light-emitting element according to claim 13 , wherein the reflective film is not formed on side surfaces of the depressed part.
15. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the reflective film is formed on side surfaces of the depressed part.
16. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the reflective film is provided on the n-electrode.
17. The ultraviolet semiconductor light-emitting element according to claim 1 , wherein the reflective film is provided on at least a part of a surface of the n-type nitride semiconductor layer where the n-electrode is not formed.