IP Library Granted Patent US 8,814,389
Granted Patent B2
US 8,814,389 · App. 13/706,303 · Granted Aug 26, 2014

Metal core printed circuit board as heat sink for LEDs

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,814,389
App. No.
13/706,303
Granted
Aug 26, 2014
Kind
B2
Abstract

Power LEDs are implanted in a specially designed printed circuit board (PCB) that is known in the art as a Metal Core Printed Circuit Board (MCPCB). The MCPCB is bended over to so as to have rounded corners having a radius that is not smaller than a determined value depending of the overall thickness of the MCPCB and other factors without any negative effects on the insulating layer and copper traces in the area of bending. In this manner, the surface area of the heat sink used in an LED nail care curing appliance is increased. The MCPCB with installed LEDs with rounded corners thereby follows the natural curvature (based on the shape of a human hand) of the appliance housing, eliminating the need for additional heat sinks or fans to reduce the heat generated by the LEDs.

Claims (5)

1. A fingernail coating curing apparatus comprising:

a) a housing with an opening configured to receive fingers of a human hand;

b) a metal core printed circuit board with a plurality of LEDs mounted thereon;

wherein said metal core printed circuit board includes a bended portion for increasing surface area of said metal core printed circuit board in an area surrounding said mounted LEDs, and said bended portion has a radius which is function of a thickness of an insulating layer and metal layer of said metal core printed circuit board, and a material used as said insulating layer.

2. The fingernail coating curing apparatus defined by claim 1 wherein said LEDs are mounted facing downward from a top of said housing towards a base of said housing.

Assignments (5)
RELEASE OF SECURITY INTEREST OF REEL/FRAME 040381/0593 Recorded Apr 12, 2018
From: JPMORGAN CHASE BANK, N.A.
To: COTY INC.; OPI PRODUCTS, INC.
Reel/Frame 045930/0001 →
RELEASE OF SECURITY INTEREST OF REEL/FRAME 040381_0613 Recorded Apr 12, 2018
From: JPMORGAN CHASE BANK, N.A.
To: COTY INC.; OPI PRODUCTS, INC.
Reel/Frame 045930/0094 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Oct 17, 2016
From: COTY INC.; OPI PRODUCTS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 040381/0593 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Oct 17, 2016
From: COTY INC.; OPI PRODUCTS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 040381/0613 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2013
From: HORVATH, GAVRIL
To: O P I PRODUCTS, INC.
Reel/Frame 030432/0083 →