IP Library Granted Patent US 8,852,974
Granted Patent B2
US 8,852,974 · App. 13/707,168 · Granted Oct 7, 2014

Semiconductor light-emitting device and method for manufacturing the same

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Quick Facts
Patent No.
US 8,852,974
App. No.
13/707,168
Granted
Oct 7, 2014
Kind
B2
Abstract

A method for manufacturing semiconductor light-emitting devices comprising the steps of: providing a multi-layer semiconductor film comprising a surface; roughening the surface of the multi-layer semiconductor film to form a scattering surface; re-growing a semiconductor layer on the scattering surface; and roughening the semiconductor layer to form a sub-scattering portion on the scattering surface; wherein the sub-scattering portion is structurally smaller than the scattering surface.

Claims (14)

1. A method for manufacturing semiconductor light-emitting devices, comprising the steps of:

providing a multi-layer semiconductor film comprising a surface;

roughening the surface of the multi-layer semiconductor film to form a scattering surface;

re-growing a semiconductor layer on the scattering surface; and

roughening the semiconductor layer to form a sub-scattering portion on the scattering surface by wet etching;

wherein the sub-scattering portion is structurally smaller than the scattering surface, and the semiconductor layer comprises different crystal planes.

2. The method according to claim 1 , further comprising the steps of:

providing a substrate; and

growing the multi-layer semiconductor film on the substrate, wherein the scattering surface is opposite to the substrate.

3. The method according to claim 1 , wherein the step of growing the multi-layer semiconductor film comprises forming a light emitting layer for emitting light.

4. The method according to claim 1 , wherein the wet etching solution comprises hydrofluoric acid or nitric acid.

5. The method according to claim 1 , wherein the roughness scale of the sub-scattering portion is nano scale.

6. The method according to claim 1 , further comprising

re-growing a second semiconductor layer on the first semiconductor layer and the scattering surface after the step of roughening the semiconductor layer.

Assignments (2)
CHANGE OF NAME Recorded Feb 26, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075152/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2012
From: HUANG, CHIEN-FU; CHEN, YI-MING; LAI, YI-TANG; HSU, CHIA-LIANG; YANG, TSUNG-HSIEN; HSU, TZU-CHIEH
To: EPISTAR CORPORATION
Reel/Frame 029420/0677 →