Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof
View Patent ↗A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect.
1. A heat dissipating structure of an LED circuit board, comprising:
an LED circuit board having a light radiating surface and a heat dissipating surface opposite to the light radiating surface, a plurality of soldering points being formed on the heat dissipating surface; and
a coating layer on the heat dissipating surface covering the plurality of soldering points of the LED circuit board and the heat dissipating surface, wherein the coating layer comprises heat radiative nanoparticles comprising combinations of at least two of ZrSiO 4 , Al 2 O 3 , TiO 2 , or (Ce,La,Nd)PO 4 , a solvent, and a bonding agent, and is exposed to the environment.
2. The heat dissipating structure according to claim 1 , wherein the coating layer comprises 70%˜80% weight of the heat radiative nanoparticles, 10%˜20% weight of the bonding agent and 10%˜15% weight of the solvent.
3. The heat dissipating structure according to claim 1 , wherein the thickness of the coating layer is 10 microns to 30 microns.
4. The heat dissipating structure according to claim 1 , wherein the heat radiative nanoparticles are boron nitride particles.
5. The heat dissipating structure according to claim 3 , wherein the coating layer comprises 70%˜80% weight of the heat radiative nanoparticles, 10%˜20% weight of the bonding agent and 10%˜20% weight of a parting agent.
6. The heat dissipating structure according to claim 3 , wherein the thickness of the coating layer is 10 microns to 25 microns.
7. The heat dissipating structure according to claim 1 , wherein the bonding agent is polyimide resin, acrylic resin or polyester resin.
8. The heat dissipating structure according to claim 1 , wherein a plurality of LEDs are coupled on the light radiating surface, each LED including a light emitting chip, two conductive pins and a light transmitting lens, and each conductive pin is disposed through the LED circuit board and the soldering point is formed thereon.
9. An LED tube including a heat dissipating structure of an LED circuit board, comprising:
an LED circuit board having a light radiating surface and a heat dissipating surface opposite to the light radiating surface, and the heat dissipating surface disposing a plurality of soldering points thereon and the light radiating surface disposing a plurality of LEDs thereon;
a coating layer on the heat dissipating surface covering the soldering points, wherein the coating layer comprises heat radiative nanoparticles comprising combinations of at least two of ZrSiO 4 , Al 2 O 3 , TiO 2 , or (Ce,La,Nd)PO 4 ), a solvent, and a bonding agent, and is exposed to the environment; and
a lamp tube for containing the LED circuit board, the lamp tube having a plurality of heat dissipation holes disposed on the left and right sides of the tube, the heat dissipation holes disposed toward the heat dissipating surface of the LED circuit board.
10. The LED tube according to claim 9 , wherein the coating layer comprises 70%˜80% weight of the heat radiative nanoparticles, 10%˜20% weight of the bonding agent and 10%˜15% weight of the solvent.
11. The LED tube according to claim 9 , wherein the thickness of the coating layer is 10 microns to 30 microns.
12. The LED tube according to claim 9 , wherein the heat radiative nanoparticles are boron nitride particles.
13. The LED tube according to claim 12 , wherein the coating layer comprises 70%˜80% weight of the heat radiative nanoparticles, 10%˜20% weight of the bonding agent and 10%˜20% weight of a parting agent.
14. The LED tube according to claim 12 , wherein the thickness of the coating layer is 10 microns to 25 microns.
15. The LED tube according to claim 9 , wherein the bonding agent is polyimide resin, acrylic resin or polyester resin.
16. The LED tube according to claim 9 , wherein the LEDs include a light emitting chip, two conductive pins and a light transmitting lens, and the conductive pins are disposed through the LED circuit board and the soldering point is formed thereon.