Micro device transfer head heater assembly and method of transferring a micro device
A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
1. A transfer head assembly comprising:
a heater assembly; and
a base substrate supporting an array of electrostatic transfer heads;
wherein each electrostatic transfer head comprises a mesa structure of 1 to 100 μm scale in both x and y dimensions, and the heater assembly is configured to heat each electrostatic transfer head to a temperature above 156.7° C.
2. The transfer head assembly of claim 1 , wherein the heater assembly comprises a heating element and a heat distribution plate.
3. The transfer head assembly of claim 1 , further comprising a dielectric layer covering the mesa structure of each electrostatic transfer head.
4. The transfer head assembly of claim 3 , wherein each mesa structure is integrally formed with the base substrate.
5. The transfer head assembly of claim 3 , wherein the dielectric layer is 0.5-2.0 μm thick.
6. The transfer head assembly of claim 3 , wherein each mesa structure is 1-5 μm thick.
7. The transfer head assembly of claim 1 , wherein each electrostatic transfer head incorporates a monopolar electrode configuration.
8. The transfer head assembly of claim 1 , wherein each electrostatic transfer head incorporates a bipolar electrode configuration.
9. The transfer head assembly of claim 8 , wherein each electrostatic transfer head comprises a pair of mesa structures, with each mesa structure of 1 to 100 μm scale in both x and y dimensions.
10. The transfer head assembly of claim 9 , wherein each mesa structure is integrally formed with the base substrate.
11. The transfer head assembly of claim 10 , wherein each mesa structure and the base substrate comprise silicon.
12. The transfer head assembly of claim 11 , further comprising a dielectric layer covering the pair of mesa structures of each electrostatic transfer head.
13. The transfer head assembly of claim 1 , wherein each electrostatic transfer head is configured to apply a separate electrostatic grip pressure to a separate micro device of 1 to 100 μm scale.
14. A transfer tool comprising:
a transfer head assembly comprising:
a heater assembly; and
a base substrate supporting an array of electrostatic transfer heads;
wherein each electrostatic transfer head comprises a mesa structure of 1 to 100 μm scale in both x and y dimensions, and the heater assembly is configured to heat each electrostatic transfer head to a temperature above 156.7° C.; and
a carrier substrate heater assembly.
15. The transfer tool of claim 14 , wherein the carrier substrate heater assembly is configured to heat a carrier substrate to 146.7° C.
16. The transfer tool of claim 14 , wherein the carrier substrate heater assembly is configured to heat a carrier substrate to 349° C.
17. The transfer tool of claim 14 , wherein the carrier substrate heater assembly comprises a carrier substrate heating element and a carrier substrate heat distribution plate.
18. The transfer tool of claim 14 , further comprising a receiving substrate heater assembly.
19. The transfer tool of claim 18 , wherein the receiving substrate heater assembly is configured to heat a receiving substrate to 146.7° C.
20. The transfer tool of claim 18 , wherein the receiving substrate heater assembly is configured to heat a receiving substrate to 349° C.
21. The transfer tool of claim 18 , wherein the receiving substrate heater assembly comprises a receiving substrate heating element and a receiving substrate heat distribution plate.
22. The transfer tool of claim 14 , wherein each electrostatic transfer head incorporates a monopolar electrode configuration.
23. The transfer tool of claim 14 , wherein each electrostatic transfer head incorporates a bipolar electrode configuration.
24. The transfer tool of claim 23 , wherein each electrostatic transfer head comprises a pair of mesa structures, with each mesa structure of 1 to 100 μm scale in both x and y dimensions.
25. The transfer tool of claim 24 , wherein each mesa structure is integrally formed with the base substrate.
26. The transfer tool of claim 25 , wherein each mesa structure and the base substrate comprise silicon.
27. The transfer head assembly of claim 26 , further comprising a dielectric layer covering the pair of mesa structures of each electrostatic transfer head.
28. The transfer tool of claim 14 , wherein each electrostatic transfer head is configured to apply a separate electrostatic grip pressure to a separate micro device of 1 to 100 μm scale.