Cooling Device For Electronic Components
A cooling device for electronic components is a combination of substrate (aluminum nitride substrate—thermoelectric elements—aluminum nitride substrate) and utilizing the temperature difference generated by two top and bottom ends of the cooling device to effectively remove the heat generated by the electronic components. This cooling device not only can effectively reduce temperature of the electronic components, but also store the power generated by its thermoelectric effect.
1 . A cooling device for electronic components, comprising:
a first substrate having a first surface and a second surface;
at least one electronic element configured on the first surface of the first substrate;
a thermoelectric element configured on the second surface of the first substrate so as to conduct the heat generated by the at least one electronic element;
a second substrate having a third surface and a fourth surface, the third surface of the second substrate coupled to the thermoelectric element so as to conduct the heat to the fourth surface; and
a battery coupled between the first substrate and the second substrate for storing energy generated by the cooling device,
wherein the first substrate and the second substrate are made of an insulating ceramic material selected from one of the following group consisting of: alumina and aluminum nitride.
2 . The cooling device as recited in claim 1 , wherein the first substrate is a metallized circuit.
3 . The cooling device as recited in claim 1 , wherein a greater a temperature difference between the first substrate and the second substrate is, a greater electric energy is so generated.
4 . The cooling device as recited in claim 1 , wherein the at least one electronic element is one selected from the following group consisting of: an LED, a CPU and a solar focusing device.
5 . The cooling device as recited in claim 1 , wherein the thermoelectric element comprises:
a first conductive layer comprising a plurality of first electrodes, configured on the second surface of the first substrate;
a second conductive layer comprising a plurality of second electrodes, configured on the third surface of the second substrate; and
a plurality of N-type semiconductors and a plurality of P-type semiconductors, wherein the plurality of N-type semiconductors and the plurality of P-type semiconductors are alternatively configured between the plurality of first electrodes and the plurality of second electrodes, and are coupled to the plurality of first electrodes and the plurality of second electrodes so as to form a current loop.
6 . The cooling device as recited in claim 1 , wherein the first surface of the first substrate is a cooling surface.
7 . The cooling device as recited in claim 1 , wherein the first surface of the first substrate is a heating surface.