IP Library Granted Patent US 8,586,909
Granted Patent B2
US 8,586,909 · App. 13/711,543 · Granted Nov 19, 2013

Method of manufacturing an optical member having stacked high and low refractive index layers

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,586,909
App. No.
13/711,543
Granted
Nov 19, 2013
Kind
B2
Abstract

A method of making an optical member including high refractive index layers and low refractive index layers, which are each relatively thin as compared with an optical length, and disposed alternately in the lateral direction with respect to an optical axis. Each width of the high refractive index layers and the low refractive index layers is equal to or smaller than the wavelength order of incident light.

Claims (6)

1. A method of making a solid-state imaging device comprising the steps of:

forming a first alternate placement layer on a semiconductor substrate where a light reception portion is formed; and

forming a second alternate placement layer at a light incident side of the first alternate placement layer;

wherein,

each of forming the first and second alternate placement layers comprises (a) forming low refractive index layers having a small refractive index, (b) forming high refractive index layers having a great refractive index on said low refractive index layers, (c) forming a plurality of opening portions in said high refractive index layers at positions corresponding to said light reception portion by arraying said plurality of opening portions, and (d) embedding each of said opening portions with said low refractive index layers,

the foregoing results in a single optical member where said high refractive index layers and said low refractive index layers are disposed alternately in each of the first and second alternate placement layers in the lateral direction relative to an optical axis, and that is integral with said semiconductor substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2013
From: TODA, ATSUSHI
To: SONY CORPORATION
Reel/Frame 029750/0823 →