Solid-state imaging apparatus and method of producing a solid-state imaging apparatus
View Patent ↗A solid-state imaging apparatus in which heat dissipation and electromagnetic shielding can be efficiently performed is provided. The solid-state imaging apparatus includes: an MCM board 41 on which a sensor 42 , and a SiP 44 that processes an output signal from the sensor 42 are mounted; a power supply board 61 on which a power supply IC 62 is mounted; and a shielding section 50 which is placed between the MCM board 41 and the power supply board 61 to cover the power supply IC 62 , and which has an electrically conductive property and a thermally conductive property.
1. A solid-state imaging apparatus including:
a first board on which a solid-state imaging element, and a signal processing circuit that processes an output signal from the solid-state imaging element are mounted;
a second board on which a power supplying circuit is mounted, the power supplying circuit being configured to supply electric power to the signal processing circuit;
an electromagnetic shielding and heat dissipation plate which is placed between the first board and the second board to cover the power supplying circuit, and which has an electrically conductive property and a thermally conductive property; and
a case which houses the first board and the second board, wherein:
the electromagnetic shielding and heat dissipation plate covers a side surface of the second board,
the electromagnetic shielding and heat dissipation plate is thermally in contact with the signal processing circuit mounted on the first board or the power supplying circuit mounted on the second board, and
the electromagnetic shielding and heat dissipation plate is thermally in contact with the case.
2. The solid-state imaging apparatus according to claim 1 , wherein:
the case is configured by a first case which houses the first board, and a second case which houses the second board, and
the electromagnetic shielding and heat dissipation plate is sandwiched between the first case and the second case.
3. The solid-state imaging apparatus according to claim 1 , wherein an end portion of the electromagnetic shielding and heat dissipation plate elastically butts against the case.
4. A method of producing a solid-state imaging apparatus according to claim 3 , including the steps:
mounting the solid-state imaging element, and the signal processing circuit that processes the output signal from the solid-state imaging element, on the first board;
mounting the power supplying circuit on the second board, the power supplying circuit being configured to supply electric power to the signal processing circuit;
placing the electromagnetic shielding and heat dissipation plate which has an electrically conductive property and a thermally conductive property, between the first board and the second board, to cover the power supplying circuit;
housing the first board and the second board in the case; and
ultrasonic welding an end portion of the electromagnetic shielding and heat dissipation plate with the case.
5. The solid-state imaging apparatus according to claim 1 , wherein:
a lens unit which holds a lens is fixed to the first board, and in contact with the case, and
a coefficient of thermal conductivity of the electromagnetic shielding and heat dissipation plate is higher than a coefficient of thermal conductivity of the lens unit.
6. The solid-state imaging apparatus according to claim 1 , wherein the electromagnetic shielding and heat dissipation plate is formed by a metal plate.
7. The solid-state imaging apparatus according to claim 1 , wherein the electromagnetic shielding and heat dissipation plate is formed by a graphite sheet.
8. The solid-state imaging apparatus according to claim 1 , wherein the signal processing circuit includes a digital signal processor.
9. The solid-state imaging apparatus according to claim 1 , wherein the electromagnetic shielding and heat dissipation plate is in direct contact with the case.
10. The solid-state imaging apparatus according to claim 1 , wherein the power supplying circuit is electromagnetically shielded by the electromagnetic shielding and heat dissipation plate.
11. The solid-state imaging apparatus according to claim 1 , wherein the electromagnetic shielding and heat dissipation plate is concave toward the first board.
12. The solid-state imaging apparatus according to claim 1 , wherein the second board is disposed within a convex portion of the electromagnetic shielding and heat dissipation plate.
13. The solid-state imaging apparatus according to claim 1 , wherein:
the electromagnetic shielding and heat dissipation plate includes a through-hole, and
a wire connecting the first board and the second board passes through the through-hole.