Methods of fabricating a photovoltaic module, and related system
View Patent ↗A method of processing a semiconductor assembly is presented. The method includes fabricating a photovoltaic module including a semiconductor assembly. The fabrication step includes performing an efficiency enhancement treatment on the semiconductor assembly, wherein the efficiency enhancement treatment includes light soaking the semiconductor assembly, and heating the semiconductor assembly. The semiconductor assembly includes a window layer having an average thickness less than about 80 nanometers, wherein the window layer includes cadmium and sulfur. A related system is also presented.
1. A system for fabricating a photovoltaic module, comprising:
a lamination unit configured to laminate a back substrate and a semiconductor assembly together to form a photovoltaic module; and
a conditioning unit configured to perform an efficiency enhancement treatment on the semiconductor assembly, wherein the efficiency enhancement treatment comprises an accelerated lifetime light-soaking treatment, the conditioning unit comprising a light source configured to irradiate light on at least a portion of semiconductor assembly.
2. The system of claim 1 , wherein the conditioning unit further comprises a heating unit configured to heat the semiconductor assembly at a temperature greater than 65° C.
3. The system of claim 1 , wherein the conditioning unit further comprises a heating unit configured to heat the semiconductor assembly at a temperature greater than 105° C.
4. The system of claim 1 , wherein the conditioning unit is configured such that the efficiency enhancement step is effected simultaneously with the lamination step in the lamination unit.
5. The system of claim 1 , wherein the conditioning unit is configured such that the efficiency enhancement step is effected after the lamination step.
6. The system of claim 1 , further comprising a conveying unit configured to transport the photovoltaic module from the lamination unit to the conditioning unit.
7. A system for fabricating a photovoltaic module, comprising:
a lamination unit configured to laminate a back substrate and a semiconductor assembly together to form a photovoltaic module; and
a conditioning unit configured to perform an efficiency enhancement treatment on the semiconductor assembly, wherein the efficiency enhancement treatment comprises an accelerated lifetime light-soaking treatment, the conditioning unit comprising a heat source and a light source configured to irradiate light on at least a portion of semiconductor assembly, wherein the conditioning unit is configured such that the efficiency enhancement step is effected simultaneously with the lamination step in the lamination unit.
8. The system of claim 7 , wherein the conditioning unit further comprises a heating unit configured to heat the semiconductor assembly at a temperature greater than 105° C.
9. The system of claim 1 , wherein the lamination unit comprises a transparent plate.
10. The system of claim 1 , wherein the light source is configured to irradiate light through fiber optics.
11. The system of claim 1 , wherein the light source is configured to irradiate light from a side of the semiconductor assembly.
12. The system of claim 7 , wherein the lamination unit comprises a transparent plate.
13. The system of claim 7 , wherein the light source is configured to irradiate light through fiber optics.
14. The system of claim 7 , wherein the light source is configured to irradiate light from a side of the semiconductor assembly.
15. A system for fabricating a photovoltaic module, comprising:
a lamination unit configured to laminate a back substrate and a semiconductor assembly together to form a photovoltaic module; and
a conditioning unit configured to perform an efficiency enhancement treatment on the semiconductor assembly in the absence of an external voltage bias across the semiconductor assembly, wherein the efficiency enhancement treatment comprises an accelerated lifetime light-soaking treatment, the conditioning unit comprising a light source configured to irradiate light on at least a portion of semiconductor assembly.